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Advanced packaging Lead-free

Micronox MX2628/ Kyzen Environmentally friendly, versatile aqueous solution with long tank life Removes latest lead-free technology from advanced packaging in batch or in-line cleaning machines 170 N/A N/A 93 0.05... [Pg.156]

Lau, J.H. and Liu, K. Global trends in lead-free soldering, part I. Advanced Packaging, Jan. 2004. [Pg.1315]

M., Bixenman, Miller, E.,and Rued, F, Lessons Learned and Best Practices Developed for Cleaning Pb-Free Flux Residues from Printed Circuit Assemblies and Advanced Packages, paper presented for the IPC/JEDEC International Conference on Lead-Free Electronic Components and Assembly, 2006, Singapore. [Pg.1025]

Case studies. Lead-free soldering processes have recently been developed for various advanced packages, including 0201 (0.02 in. X 0.01 in.) components, 01005 (0.01 in. X 0.005... [Pg.8]

A. Schubert, et al., Thermal Mechanical Properties and Creep Deformation of Lead-Containing and Lead-Free Solders, 2001 International Symposium on Advanced Packaging, Materials Proc., 2001, p 129-134... [Pg.106]

L. Xiao, J. Liu, Z. Lai, L. Ye, and A. Tholen, Characterization of Mechanical Properties of Bulk Lead-Free Solders, Sixth International Symposium on Advanced Packaging Materials, 2000, p 145-151... [Pg.223]

Li Yi, Wong CP. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging materials, processing, reliability and applications. Mater Sci Eng. 2006 51(1—3, 30) 1-35. [Pg.180]

Dusek, M. Nottay, J. Hunt, C. Compatibility of lead-free alloys with current PCB materials. Proceedings, International Confeerence on Advanced Packaging Systems, Reno, NV, 2002 110-115. Coombs, C. Printed Circuits Handbook, 4th Ed., McGraw-Hill New York, 1995. [Pg.568]

Kehoe, L. Crean, G.M. Thermal conductivity and specific heat determination of a set of lead-free solder alloys. Proc. 4th International Symposium and Exhibition on Advanced Packaging Materials, Georgia, USA, March 1998 203-208. [Pg.727]

Woojin Choi Senior Packaging Engineer Intel Corporation, Arizona, U.S.A. Mr. Choi is involved in the advanced electronic packaging development for the next-generation microprocessor in the Intel Corporation. He is focusing on the lead-free C4 solder bump joints in the package for the high-speed microprocessors. [Pg.1016]

See other pages where Advanced packaging Lead-free is mentioned: [Pg.83]    [Pg.1313]    [Pg.144]    [Pg.233]    [Pg.431]   
See also in sourсe #XX -- [ Pg.2 , Pg.4 , Pg.4 , Pg.4 , Pg.11 , Pg.16 ]



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