Advanced Component Packaging

S. A. Kuhn, M. B. Kleiner, P. Ramm, W. Weber. Performance modeling of the interconnect structure of a three-dimensional integrated RISC processor/cache system. IEEE Trans. On Components, Packaging, and Manufacturing Technology, Part B Advanced Packaging, Vol. 19, Nov. 1996, pp. 719 - 727. 

K. E. Goodson, K. Kurabayashi. and R. F. W. Pease, IEEE Transactions on Components Packaging and Manufacturing Technology, 1997, Part B. - Advanced Packaging 20-1, 104-109. 

The primary journals are the IEEE Transactions on Components, Packaging and Manufacturing Technology, Parts A and B, and Advancing Microelectronics, published by ISHM. 

IEEE Transcation on Components, Packaging, and Manufacturing Technology—Part B Advanced Packaging. 

As soon as the amount of circuitry and the technology that each PCB must contain is known, the area and size of each PCB may be estimated. Often, the PCB size is fixed in advance by the end use. For example, a system based on VME or multibus technology will have to use the PCB sizes defined by the standard. In this case, system partitioning and component packaging technology will be dictated by what will fit onto these standard PCB sizes. 

Advances in interconnection technologies have occurred in response to the evolution of component packages, electronic technology, and increasingly complex fnnctions. Therefore, it comes as no surprise that various forms of printed wiring remain the most popular and cost-effective method of interconnections. 

N. C. Stofifel, M Hsieh, E. J. Kramer, W. Volksen, IEEE Transactions on Components, Packaging, and Manufactirr-ing Technology Part B Advanced Packaging, 19, 417 (19%). 

Device, package, electronics and the assembly and packaging technology constitute the core components of the MST product. These rely heavily on the advances in materials science and technology. 

Parts II, III, and IV cover basic techniques for modeling with objects and advanced techniques for factoring and then recombining models and designs using packages, frameworks, and components. They do not describe a development process the steps to validate and document these models. 

---