Adhesives electrical properties

These very specific properties will be defined and studied in the relevant 40 chapters of this Handbook, which are devoted to the specific industries. For instance, in this Volume 1, chapter 6 Adhesives for electronics indicates all the specific characteristics of these adhesives (electrical properties, etc.). 

It is a very lightweight rubber and has very good weathering and electrical properties, excellent adhesion, and excellent ozone resistance. 

Silicone rubbers have excellent ozone and weathering resistance, good electrical properties, and good adhesion to metal. 

Chemical treatments commonly appHed to cormgated paperboard packaging materials include additives that impart various degrees of water resistance, humidity resistance, oil and grease resistance, product abrasion resistance, product corrosion resistance, adhesion release properties, flame-retardant properties, nonskid properties, and static electricity control properties to the finished package (1,2). 

Sihcones (qv) have an advantage over organic resias ia their superior thermal stabiUty and low dielectric constants. Polyurethanes, when cured, are tough and possess outstanding abrasion and thermal shock resistance. They also have favorable electrical properties and good adhesion to most surfaces. However, polyurethanes are extremely sensitive to and can degrade after prolonged contact with moisture as a result, they are not as commonly used as epoxies and sihcones (see Urethane polymers). 

Plasma processing technologies ate used for surface treatments and coatings for plastics, elastomers, glasses, metals, ceramics, etc. Such treatments provide better wear characteristics, thermal stability, color, controlled electrical properties, lubricity, abrasion resistance, barrier properties, adhesion promotion, wettability, blood compatibility, and controlled light transmissivity. 

The bisphenol A-derived epoxy resins are most frequendy cured with anhydrides, aUphatic amines, or polyamides, depending on desired end properties. Some of the outstanding properties are superior electrical properties, chemical resistance, heat resistance, and adhesion. Conventional epoxy resins range from low viscosity Hquids to soHd resins. 

Epoxy resins have outstanding mechanical and electrical properties, dimensional stability, resistance to heat and chemicals, and adhesion to other materials. They are used for casting, potting, encapsulation, protective coatings, and adhesives. Epoxy glues separate the resin from the curing. igciU to be mixed just prior to use. 

EPM and EPDM are not oil resistant, and are swollen by aliphatic and aromatic hydrocarbons, and halogenated solvents. They have excellent electrical properties and stability to radiation. Their densities are the lowest of the synthetics, and they are capable of accepting large quantities of filler and oil. They exhibit poor tack, and even if tackifiers are added, it still is not ideal for building operations. Adhesion to metal, fabrics and other materials, can be difficult to accomplish. 

Articles made from amino resins are water clear, hard, and strong, but they can crack. They have good electrical properties, and they have better colorability than phenolic resins. Amino resins are used as adhesives for plywood and particleboard but only in interior grades. They have low weather resistance and deteriorate when exposed to sun, heat, cold, and moisture. 

Nylons 6/6 and 6 comprise more than 90% of the polyamide market. The two have similar properties but nylon 6 has a lower Tm (223°C). Small amounts of nylons 6/9, 6/10, 6/12, 11, 12, 12/12, and 4/6 are produced as specialty materials. Those with more methylene groups than nylons 6/6 and 6 have better moisture resistance, dimensional stability, and electrical properties, but the degree of crystallinity, Tm, and mechanical properties are lower. Specialty nylons made from dimerized fatty acids find applications as hot-melt adhesives, crosslinking agents for epoxy resins, and thermographic inks. 

In the crosslinked state, epoxy resins are highly resistant to chemicals, temperature, and solvents and are also endowed with good electrical properties. They are therefore employed, for example, as casting resins in electro- and electronic industry as well as resistant lacquers and coatings. Moreover, they possess excellent adhesive power for many plastics, wood, and metals ( reaction adhesives two-component adhesives ). 

On the other hand, the alkoxide system presented several problems in formulation. The system first chosen as a model consisted of a trimethoxymethyl silane crosslinker, 8000 centistoke HEB siloxane, and a catalyst. A number of catalysts were used and each exhibited different cure rates and electrical properties. DuPont tetraalkoxytitante-Tyzor appears to he one of the better catalysts used in this type of curing system. Fillers are usually incorporated into the silicone formulation to improve mechanical properties, promote adhesion, and to serve as light screening and pigment agents. Cab-o-sil, a form of fumed silica, carbon-black, titanium dioxide and calcium carbonate are then used as RTV fillers. 

The adhesives are suitable for use in flip chip bonding of semiconductor parts. They exhibit good shelf stability, productivity, strength properties and heat resistance. The electrical properties, such as dielectric constant and dielectric loss tangent are highly satisfactory. 

Fluoropolymers. These form one of our oldest and most spectacular families of engineering plastics. Polytetrafluoroethylene was developed by DuPont over two decades ago, and more recently by Allied Chemical, Hoechst, ICI, Pennwalt, and other manufacturers as well. It combines unusually low adhesion and friction, high temperature and flame resistance, excellent electrical properties, and extreme chemical inertness. Its high melting point and melt viscosity make thermoplastic processing extremely difficult, so that many... 

A recent review [1] on polyimide adhesion to metal and ceramic surfaces shows the relevance of this topic to many different technological areas. Of all the polyimides studied thus far, it is evident that the most popular one is PMDA-ODA. It has very good mechanical, thermal, and electrical properties, but it suffers from poor adhesion characteristics. This problem is often overcome by the application of an adhesion promoter to the surface of interest. The most popular adhesion promoter appears to be APS. An excellent review concerning APS has been written by Ishida [2]. A wealth of information concerning silane coupling agents can also be found in the book by Plueddemann [3],... 

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