Adhesives capillary-flow

A number of instruments are based on the extmsion principle, including slit flow and normal capillary flow (Table 6). These instruments are useful when large numbers of quality control or other melt viscosity test measurements are needed for batches of a single material or similar materials. When melt viscosities of a wide range of materials must be measured, rotational viscometers are preferable. Extmsion rheometers have been applied to other materials with some success with adhesives and coatings (10,161). 

Fluoropolymers have been used as processing aids because small quantities can reduce signih-cantly the overall viscosity and thus facilitate extrusion. Feng et al. [1996] examined the mechanism of viscosity reduction in the capillary flow of HDPE/fluoroelastomer blends. X-ray photoelectron spectroscopy, used to characterize the composition of the extmdates surface, indicated only very small traces of the fluoroelastomer on the extrudate, pointing to the fact that the viscosity reduction is due to adhesive failure between the fluoropolymer layer and HOPE. 

Adhesives used to fill spaces underneath a flip-chip device or BGA package must flow readily and rapidly when dispensed at the edges of the chip in order to completely fill the gap and free space surrounding the solder bumps. To be effective, the adhesive must be drawn into the narrow space by capillary action. The theory behind underfilling is based on capillary-flow behavior between closely spaced parallel plates (Fig. 2.5) by considering the drop in pressure (p) across a liquid-vapor interface ... 

The flow properties of an adhesive are largely controlled by its inherent viscosity and by the alteration of its viscosity through the addition of diluents and fillers. How properties are important for screen-printing, automatic dispensing, and capillary flow, and can be tailored by the type of filler, amount of filler, and the particle-size distribution. 

Figure 4.12 Dispense patterns for capillary-flow underfill adhesives Top 1 shape Middle L shape Bottom modified XP shape.

In the application of capillary-flow underfills, there are so many material, process, and equipment variables that empirical methods are widely used to establish the optimum processing conditions. The viscosity and flow properties of underfill adhesives are among the most important variables in rapidly filling different gap sizes and devices. A list of some commercially available underfill adhesives and their flow properties, as related to filler size and gap height, is given in Table 5.3. 

In addition to capillary-flow underfilling, a new approach to underfilling has been developed whereby the underfill material is applied before attaching the flip-chip or BGA device. Specially formulated adhesives, known as no-flow underfills (NFU) or... 

Once cured, the properties of NFUs are similar to those of capillary-flow underfills. One major difference is that the no-flow materials are generally unfilled and, as a result, their expansion coefficients are higher than those of their filled counterparts. However, their lower moduli more than compensate for the mismatches in expansion coefficients. NFU adhesives have shorter shelf lives than capillary-flow types because of the incorporation of the fluxing agent into the adhesive formulation. Table 5.4 is a compilation of underfills and their properties while Table 5.5 lists examples of capillary flow and no-flow underfills and their applications. 

Viscosity is the internal friction that results from intermolecular forces of attraction and interactions between fillers and resins in adhesives, a measure of resistance to flow. Most adhesives are non-Newtonian fluids that exhibit shear-thinning behavior, or decrease in viscosity with increasing shear rate. Exceptions to this general rule are the capillary-flow underfill adhesives that tend to be Newtonian in fluid behavior. 

Besides viscosity, the surface-wetting ability of underfills is critical to capillary flow. For capillary flow to occur, the underfill material must wet the surfaces so that the advancing contact angle is less than 90°. " Also, for capillary flow, the intramolecular forces of attraction among adhesive molecules must be weaker than the intermolecular attraction of the adhesive for the die, the substrate, and the solder surfaces.t This occurs when the surface tension of the underfill is lower than the surface energy of... 

Table 5.5. Examples of Capillary-flow and No-flow Underfill Adhesives and Applications... 

On the other hand, it is a blessing that our red blood cells do not stick together because capillary flow would then be impossible. Unfortunately, some cancer cells are not sticky enough and spread because the malignant cell adhesion is too low to prevent migration. The conclusion is that we wish to understand and control both high and low adhesion within our bodies. 

Thixotropic adhesives, which are not subject to capillary flow, are needed to bond laminated rotors to their shafts because the laminated rotor will remove other (Newtonian) adhesives from the joint area by capillary action, preventing a satisfactory bond. 

---