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Capillary flow underfill adhesives

Figure 4.12 Dispense patterns for capillary-flow underfill adhesives Top 1 shape Middle L shape Bottom modified XP shape. Figure 4.12 Dispense patterns for capillary-flow underfill adhesives Top 1 shape Middle L shape Bottom modified XP shape.
Viscosity is the internal friction that results from intermolecular forces of attraction and interactions between fillers and resins in adhesives, a measure of resistance to flow. Most adhesives are non-Newtonian fluids that exhibit shear-thinning behavior, or decrease in viscosity with increasing shear rate. Exceptions to this general rule are the capillary-flow underfill adhesives that tend to be Newtonian in fluid behavior. [Pg.351]

In the application of capillary-flow underfills, there are so many material, process, and equipment variables that empirical methods are widely used to establish the optimum processing conditions. The viscosity and flow properties of underfill adhesives are among the most important variables in rapidly filling different gap sizes and devices. A list of some commercially available underfill adhesives and their flow properties, as related to filler size and gap height, is given in Table 5.3. [Pg.225]

In addition to capillary-flow underfilling, a new approach to underfilling has been developed whereby the underfill material is applied before attaching the flip-chip or BGA device. Specially formulated adhesives, known as no-flow underfills (NFU) or... [Pg.226]

Once cured, the properties of NFUs are similar to those of capillary-flow underfills. One major difference is that the no-flow materials are generally unfilled and, as a result, their expansion coefficients are higher than those of their filled counterparts. However, their lower moduli more than compensate for the mismatches in expansion coefficients. NFU adhesives have shorter shelf lives than capillary-flow types because of the incorporation of the fluxing agent into the adhesive formulation. Table 5.4 is a compilation of underfills and their properties while Table 5.5 lists examples of capillary flow and no-flow underfills and their applications. [Pg.233]

Table 5.5. Examples of Capillary-flow and No-flow Underfill Adhesives and Applications... [Pg.291]

When the shear stress of a liquid is directly proportional to the strain rate, as in Fig. 2.4a, the liquid is said to exhibit ideal viscous flow or Newtonian behavior. Most unfilled and capillary underfill adhesives are Newtonian fluids. Materials whose viscosity decreases with increasing shear rate are said to display non-Newtonian behavior or shear thinning (Fig. 2.4b). Non-Newtonian fluids are also referred to as pseudoplastic or thixotropic. For these materials, the shear rate increases faster than the shear stress. Most fllled adhesives that can be screen printed or automatically dispensed for surface-mounting components are thixotropic and non-Newtonian. A second deviation from Newtonian behavior is shear thickening in which viscosity increases with increasing shear rate. This type of non-Newtonian behavior, however, rarely occurs with polymers. ... [Pg.42]

Adhesives used to fill spaces underneath a flip-chip device or BGA package must flow readily and rapidly when dispensed at the edges of the chip in order to completely fill the gap and free space surrounding the solder bumps. To be effective, the adhesive must be drawn into the narrow space by capillary action. The theory behind underfilling is based on capillary-flow behavior between closely spaced parallel plates (Fig. 2.5) by considering the drop in pressure (p) across a liquid-vapor interface ... [Pg.43]

Besides viscosity, the surface-wetting ability of underfills is critical to capillary flow. For capillary flow to occur, the underfill material must wet the surfaces so that the advancing contact angle is less than 90°. " Also, for capillary flow, the intramolecular forces of attraction among adhesive molecules must be weaker than the intermolecular attraction of the adhesive for the die, the substrate, and the solder surfaces.t This occurs when the surface tension of the underfill is lower than the surface energy of... [Pg.51]


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