Acoustic inspection device

Instrumentation for revealing the presence of bulk quantities of concealed drugs will differ from those developed to find evidence of minute quantities on surfaces. Bulk detection is concerned with amounts ranging from grams to kilograms [4], Bulk detection is done by manual inspection, X-ray, CT scans, and acoustic inspection. X-ray or CT scanners used as bulk detectors have sensitivity of 2-10 g, and suspect items are subsequently confirmed by chemical analysis. Hand-held acoustic inspection instruments such as the Acoustic Inspection Device (AID) and the Ultrasonic Pulse Echo (UPE) developed by Pacific Northwest National Laboratories/Battelle, can be used for analysis of cargo liquids in sealed containers of various sizes within seconds [5]. The acoustical velocity and attenuation of multiple echoes returned to the instrument is evaluated by software which compares the data to the shipping manifest. 

This requirement hides an important provision. It not only applies to inspection, measuring, and test equipment but to the measurements that are performed with that equipment. Anywhere you intend performing product verification or monitoring processes you need to ensure that the environmental conditions are suitable. By environmental conditions is meant the temperature, pressure, humidity, vibration, lighting, cleanliness, dust, acoustic noise, etc. of the area in which such measurements are carried out. To avoid having to specify the conditions each time, you need to establish the ambient conditions and write this into your procedures. If anything other than ambient conditions prevail, you may need to assess whether the measuring devices will perform adequately in these conditions. If you need to discriminate between types of equipment, the ones most suitable should be specified in the verification procedures. 

The acoustic microscopy s primary application to date has been for failure analysis in the multibillion-dollar microelectronics industry. The technique is especially sensitive to variations in the elastic properties of semiconductor materials, such as air gaps. SAM enables nondestructive internal inspection of plastic integrated-circuit (IC) packages, and, more recently, it has provided a tool for characterizing packaging processes such as die attachment and encapsulation. Even as ICs continue to shrink, their die size becomes larger because of added functionality in fact, devices measuring as much as 1 cm across are now common. And as die sizes increase, cracks and delaminations become more likely at the various interfaces. 

Acoustic microscopyf or ultrasonic inspection can be used to visualize large areas of deadhesion ( holidays ) in some cases. Mechanical response to vibration has been used to evaluate adhesion, as have SAW devices. Variable energy ultrasonic cleaners (Sec. 13.4.5) may also be used to non-destructively test film adhesion by specifying energy density and time. 

ADVANCEMENTS IN ACOUSTIC MICRO IMAGING FOR THE NON-DESTRUCTIVE INSPECTION OF CERAMIC COMPONENTS AND DEVICES... 

---