Wire sawing

Slicing (wire saw) high poor medium medium... 

The 3 mm disc was covered by a 3 pm thick polycrystalline nickel foil, then a polycrystalline molybdenum disc was placed on top of the nickel foil. This composite sandwich was placed between two alumina supports and heated for 30 min at 1350°C. The cross-sections used for microanalysis were prepared by cutting with a wire saw in a direction perpendicular to the grain boundary, then mechanically and chemically polished. 

Dentin slices. Enamel-dentin specimens were prepared by drilling a hollow cylinder through the crowns of the incisors. Dentin slices (diameter 6 mm, thickness 0.50 mm) were made as transversal sections with a water-cooled diamond wire sawing machine (Well, model 3142 W. Ebner,... 

The square or pseudo-square blocks are cut into thin wafers using multi-wire saws, a technique which was developed specifically for PV and which is now common in the semiconductor industry also. A great deal of progress has been made with equipment and process control aspects and in introducing reduced diameter wires several hundred kilometers long for reduced kerf loss. 

Building stone (dimension stone) is usually cut from the quarry face by means of a wire saw. Explosives are used only for clearing overburden or to remove obstacles. The process of quarrying is analogous to obtaining coal from opencast sites where the coal is at or near the surface of the ground. Under wet conditions,... 

A variation of the wire saw that can cut some specimens without deformation or mechanical damage is the acid string saw [13]. This is a wire saw where the abrasive is replaced by an etching agent and the cut occurs from a chemical reaction rather than mechanical abrasion. This is suitable for metals or other reactive solids that have effective etching solutions. Of... 

When the green set is sufficiently advanced and the cake is of the required consistency, the mould is removed and the cake is trimmed/cut into blocks by oscillating, or vibrating, wire saws. Surplus materials (off-cuts or returns) are recycled to the mixer, as already mentioned. If, however, cutting is delayed, the mix eventually becomes too hard to be cut and must be scrapped. Thus the cutting window is an important factor in the routine operation of the process. The use of lime as part of the binder increases the period during which the mix can be cut. 

Wafers are sliced from the boule using a diamond-tipped saw or a set of diamond-coated wires. When the wire saw is used many slices can be cut in one run (like slicing a hard-boiled egg). The substrate thickness essentially depends on the slicing operation, although the final value depends on subsequent polishing operations. 

Wire saw machines, similar in principle to those used for cutting stone, are also used widely for large demolition operations. When using a circular saw, there is a limit on the depth of cut which can be made due to the presence of the drive spindle... 

Figure 60. Wire sawing of heavily reinforced concrete.

The diacetylenes were synthesized by Dr. M. Bertault. The material was then purified, and the crystals grown according to the procedure described by Bertault et al. [13]. The samples employed in the measurements were cut in the desired directions with a wire saw, and then polished on tissues soaked with ethyl acetate. The thicknesses of the samples were ca. 0.5 mm, their electrode area amounting to about 20 mm. As-grown samples, used for the measurements in the direction perpendicular to the be plane, were usually twice larger. 

There is a large amount of wastage when explosives are used to quarry slate. Accordingly, they are sometimes quarried by using a wire saw. The slate, once won, Is sawn into blocks, and then into slabs about 75 mm thick. These slabs are split into slate tiles by hand. Riven facing stones are also produced in the same way (Fig. 6.4). 

Wafers. From this cylinder, thin wafers or slices are cut using a continuous wire saw that produces several uniform slices at the same time. The slices are subjected to numerous stages of polishing, cleaning, and quality checking, the end result of which is a consistent set of silicon wafers suitable for use as substrates for integrated circuits. 

FIGURE 2 CUTTING OF THE CO-AXIAL DUCTS CONNECTED TO THE WAGR HOTBOX USING A DIAMOND WIRE SAW... 

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