Wetted exposives

Articles fabricated from FEP resins can be made bondable by surface treatment with a solution of sodium in Hquid ammonia, or naphthalenyl sodium in tetrahydrofuran (64) to faciUtate subsequent wetting. Exposing the surface to corona discharge (65) or amines at elevated temperatures in an oxidizing atmosphere (66) also makes the resins bondable. Some of the more recent work is described in References 67—69. 

Of the two hot precompacted laminates (Laminates 3 and 4), the wet exposed laminate was of significantly poorer quality. The attenuation ranges for Laminate 3 was from 30 to 62 dB, whereas that for Laminate 4 was 10 to 42 dB. Because the hot precompaction temperature was only 66°C (150°F), the additional porosity should not be due to voids caused by the vaporization of absorbed moisture, but is more likely due to voids caused by air trapped during collation. The wet exposed prepreg exhibited a noticeable increase in tack that could contribute to increased air entrapment during collation. 

Lee T R, Carey R L, Biebuyck H A and Whitesides G M 1994 The wetting of monoiayer fiims exposing ionizabie acids and bases Langmuir 10 741-9... 

Six protective groups for alcohols, which may be removed successively and selectively, have been listed by E.J. Corey (1972B). A hypothetical hexahydroxy compound with hydroxy groups 1 to 6 protected as (1) acetate, (2) 2,2,2-trichloroethyl carbonate, (3) benzyl ether, (4) dimethyl-t-butylsilyl ether, (5) 2-tetrahydropyranyl ether, and (6) methyl ether may be unmasked in that order by the reagents (1) KjCO, or NH, in CHjOH, (2) Zn in CHjOH or AcOH, (3) over Pd, (4) F", (5) wet acetic acid, and (6) BBrj. The groups may also be exposed to the same reagents in the order A 5, 2, 1, 3, 6. The (4-methoxyphenyl)methyl group (=MPM = p-methoxybenzyl, PMB) can be oxidized to a benzaldehyde derivative and thereby be removed at room temperature under neutral conditions (Y- Oikawa, 1982 R. Johansson, 1984 T. Fukuyama, 1985). 

Improved Hot—Wet Properties. Acryhc fibers tend to lose modulus under hot—wet conditions. Knits and woven fabrics tend to lose their bulk and shape in dyeing and, to a more limited extent, in washing and drying cycles as well as in high humidity weather. Moisture lowers the glass-transition temperature T of acrylonitrile copolymers and, therefore, crimp is lost when the yam is exposed to conditions requited for dyeing and laundering. 

Sheet Drying. At a water content of ca 1.2—1.9 parts of water per part of fiber, additional water removal by mechanical means is not feasible and evaporative drying must be employed. This is at best an efficient but cosdy process and often is the production botdeneck of papermaking. The dryer section most commonly consists of a series of steam-heated cylinders. Alternate sides of the wet paper are exposed to the hot surface as the sheet passes from cylinder to cylinder. In most cases, except for heavy board, the sheet is held closely against the surface of the dryers by fabrics of carefuUy controUed permeabiHty to steam and air. Heat is transferred from the hot cylinder to the wet sheet, and water evaporates. The water vapor is removed by way of elaborate air systems. Most dryer sections are covered with hoods for coUection and handling of the air, and heat recovery is practiced in cold climates. The final moisture content of the dry sheet usually is 4—10 wt %. 

Commercial condensed phosphoric acids are mixtures of linear polyphosphoric acids made by the thermal process either direcdy or as a by-product of heat recovery. Wet-process acid may also be concentrated to - 70% P2O5 by evaporation. Liaear phosphoric acids are strongly hygroscopic and undergo viscosity changes and hydrolysis to less complex forms when exposed to moist air. Upon dissolution ia excess water, hydrolytic degradation to phosphoric acid occurs the hydrolysis rate is highly temperature-dependent. At 25°C, the half-life for the formation of phosphoric acid from the condensed forms is several days, whereas at 100°C the half-life is a matter of minutes. 

Etch Profiles. The final profile of a wet etch can be strongly influenced by the crystalline orientation of the semiconductor sample. Many wet etches have different etch rates for various exposed crystal planes. In contrast, several etches are available for specific materials which show Httle dependence on the crystal plane, resulting in a nearly perfect isotropic profile. The different profiles that can be achieved in GaAs etching, as well as InP-based materials, have been discussed (130—132). Similar behavior can be expected for other crystalline semiconductors. It can be important to control the etch profile if a subsequent metallisation step has to pass over the etched step. For reflable metal step coverage it is desirable to have a sloped etched step or at worst a vertical profile. If the profile is re-entrant (concave) then it is possible to have a break in the metal film, causing an open defect. 

Type V (High Sulfate Resistance). Type V Pordand cement is used in concrete exposed to severe sulfate attack of 1,500 to 10,000 ppm. Low concentrations of tricalcium aluminate [12042-78-3] give Type V its sulfate resistance. The sulfate resistance is improved with air entrainment and low water to cement ratios in the wet concrete. U.S. production of Type V Pordand cement in 1989 was 0.9% of the total Pordand cement production. 

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