Wet cleaning method

Any contaminated equipment should be cleaned using wet cleaning methods, such as a wet cloth prior to removal from the weigh hood. 

Note About Cleaning Methods. A number of cleaning techniques can be used. For example, a balance brush could be used to sweep residual powder off the balance and onto a filter paper. However, this method is not ideal because the powder tends to be distributed over the base of the unit. Wet cleaning methods tend to be more... 

Wet cleaning process was the first to be adopted and is still the most commonly used platform for post-CMP cleaning processes for removing leftover surface particles, organic residues, and metallic contaminations. In this section, various wet cleaning methods used in semiconductor process will be reviewed. 

Vacuum or wet-cleaning methods are preferred. If wet-cleaning is done, the equipment should be dried immediately after cleaning to prevent the growth of microorganisms. Cleaning with compressed air and bmshes should be used with care and avoided if possible, as these methods increase the risk of product contamination. 

Cleaning equipment or materials that shed particles, raise dust, produce aerosols or otherwise generate contamination should be avoided where possible. These include compressed air, bristle brushes, fibre-shedding cloths and certain designs of floor-scrubbing machines. Vacuum or wet cleaning methods are preferred. Vacuum cleaners or polishers should be fitted with fine dust filters. 

Keep the worksite clean. Use only a vacuum with a HEPA filter or wet cleaning methods when removing lead dust. Never use compressed air for cleaning. 

Wafer eleaning- wafers are cleaned in automated wet benches using the RCA wet elean method (which uses a combination of dilute acids, peroxide and bcises in a particular order). Environmental concerns has prompted the search for a new method of cleaning. 

Methods of dust removal depend mainly on the particle size of the dust and the temperature and moisture content of the gas. The methods used are broadly divided into dry methods and wet methods. The dry methods involve the use of gravity and baffle chambers, cyclones, filters, and electrostatic precipitators, while the wet methods involve the use of spray towers and venturi scrubbers. In principle, wet cleaning is preferred to dry cleaning because of the excessive wear associated with and the difficulty in handling the fine dusty material removed in the dry methods. The wet methods, however, must be followed by such operations as filtration, drying of filter cakes, and recycling of water. 

The existing cleaning methods can be divided into wet and dry cleaning. The wet cleaning process uses a combination of solvents, acids, surfactants and deionized (DI) water to spray and dissolve contaminants from the surface area. The Dl water is used to rinse after each chemical use. The oxidation of the wafer surface is sometimes integrated into the cleaning... 

Functionalization studies have been carried out at both clean and hydrogen-passivated surfaces. The vast majority of studies on clean silicon substrates are performed under dry ultra-high vacuum conditions (UHV). On the other hand, reactions at hydride-terminated silicon commonly rely on wet chemical methods performed in solution. Regardless of the different environment and surface structure, common principles of the functionalization at semiconductor surfaces are emerging from these studies. 

Decontamination of Equipment. In most cases of contamination of equipment and buildings, a mixture of normal household cleaning methods will remove the material. Prior to decontamination conduct a radiation survey of the equipment. Vacuum cleaners that can handle wet material and have high efficiency filters are particularly useful. Some surfaces may require... 

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