Vertical stacking process

In most cases, the vertical-stacking process begins at the wafer stage where the normal bond pads are first redistributed toward the edges of the die by several photolithographic process steps shown in Figures 5.14 and 5.15 and described as follows. 

The plate dryer may vary in size from 5-35 vertically stacked plates with a heat-exchange area between 3.8-175 m". The largest unit available has overall dimensions of 3 m (w) by 4 m (1) by 10 m (h). Depending upon the loose-bulk density of the material and the overall retention time, the plate dryer can process up to 5,000 kg/hr of wet product. 

Dutch An obsolete process for making basic lead carbonate pigment (white lead) by exposing metallic lead to vinegar and carbon dioxide. Reportedly first described by Theophrastos around 300 BC. Also known as the Stack process because the metal ingots were arranged in vertical stacks. See also Thompson-Stewart. 

Figures 23-28 show the process of producing basic circuit elements of vertically stacked circuits. The use of the three lithographic masking techniques mentioned results in very low loss transitions between optical circuits in different vertical stacks. These techniques can also be used to fabricate the low loss electro-optic modulator configuration shown in Figs. 29 and 30.

There are three types of deodorization operations. The batch process is the least common, due to its low efficiency and inconsistent product quality. Semi-continuous and continuous deodorizers have improved processing efficiency. There are several configurations of the continuous deodorizer, including singleshell cylindrical vessel type, vertically stacked tray type, and the thin-film packed column type. This last provides excellent fatty acid stripping with minimum use of steam, but it achieves neither desired heat bleaching nor effective deodorization due to the relatively short retention time. A retention vessel has to be used after the column distillation (De Greyt and Kellens 2000). 

In this approach, entire wafers or segments of wafers containing ICs are stacked. Interconnections are formed from vias in the silicon. In vertically stacking memory chips or other IC chips, the chips are first thinned to several mils (4 mils or less), then adhesive bonded, and electrically interconnected directly from chip-to-chip, either from the edges or through vias in the silicon. In these approaches, both electrically conductive and electrically insulative adhesives are used. Thermally conductive preform adhesives or thin thermoplastic films are used to bond and isolate the chips within the stack and to dissipate heat. Several processes are available to vertically stack and interconnect chips of the same size and function such as SRAM, flash, and DRAM memory chips. Other processes have been developed to vertically stack chips of different sizes and functions, or to horizontally interconnect different chips in one layer, then vertically stack the layers. ... 

The v cal integrated polymer device fabricated was a vartically stacked ED-polymer directional coupler (27). The nonlinear optical matmal used was a bisazo-dye functionalized EO polymer, 3RDCVXY. A standard REB process was used to fabricate the hybrid waveguides. Using die vertically stacked directional coupler, optical coupling similar to that of in-plane directional coupler was attained. 

Flaring and venting are two activities associated with oil and gas production. It is a combustion process used to dispose gases through vertical stacks or ground flares. Qatar is a world leader in gas and hydrocarbon processing. It has a world class Ethylene Cracker, Ras Laffan Olefins Company Limited (RLOC), of 1.3 million mtpa capacity. RLOC started up in April 15, 2010 and is operated by Qatar Chemical Company (QChem). 

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