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Versamides

VersaCAD Versalink Versamid Versatate VVIO Versatate VV9 Versatic 10... [Pg.1051]

The two-part epoxy adhesive, readily available in hardware stores or other consumer outlets, comes in two tubes. One tube contains the epoxy resin, the other contains an amine hardener. Common diamine room temperature epoxy curing agents are materials such as the polyamides, available under the trade name Versamid. These polyamides are the reaction products of dimer acids and aUphatic diamines such as diethylenetriamine [111-40-0] ... [Pg.232]

In the early 1950s a new class of polyamides became available differing from the nylons in that they contained bulky side groups, had a somewhat irregular structure and were of low molecular weight (2000-5000). They are marketed under such trade names as Versamids and Beckamides . [Pg.506]

Versamid 900 Organic compounds containing active halogens. [Pg.962]

Materials. The adhesives and primers used in this study were model and commercial materials that were cured according to conditions appropriate for the specific adhesive chemistry. Adhesives A and B were conventional epoxy/Versamid and epoxy/dlcyandiamlde adhesives, respectively. Adhesives C and D were commercial urethane and epoxy/polyamlde adhesives, respectively. Adhesive E was a conventional two-part epoxy/amldoamlne adhesive. Adhesive F was a vinyl plastlsol adhesive. The adhesive primers used in this study were a urethane crosslinked epoxy electrocoat primer and spray primers based on tall oil modified epoxy ester, and polyesterpolyol/isocyan-ate chemistry. Dicyandlamlde was obtained from Aldrich Chemical Company. Epon 828 was obtained from Shell Chemical Company. [Pg.195]

Genamid 250 and Versamid 115 were obtained from Henkel Company. The steel substrates used were cold rolled steel and Bonderite 40 phosphated steel from Parker. The composite was sheet molding compound from Rockwell. [Pg.195]

Adhesives based on hydrolysis resistant chemistry (i.e., adhesives D and E) show a high retention of initial properties after exposure to an aggressive corrosion environment and the failure occurs cohesively within the adhesive. The cure reactions of these adhesives involve the formation of hydrolysis resistant carbon-nitrogen bonds in reactions involving the free N-H functionality of the Versamid or Genamid hardener with the oxirane functionality of the epoxy resin that is present in the adhesive formulation ... [Pg.196]

Authors R.B. Prime and E. Sacher [51] (1972) System Resin DGEBA (DOW DER 332) Curing Agent polyamide (General Mills Versamid 140) without purification... [Pg.93]

As it had been shown that silanes were effective as pretreatments for a variety of coatings and particularly so when used as additives, selected silanes were examined as pretreatments and additives in conjunction with a two pack polyamide cured epoxide adhesive (Epikote 828/Versamid 115, 1/1) and a structural polyurethane adhesive based on diphenylmethanediisocyanate and a polyester resin. [Pg.37]

Figure 8. The effect of 2 wt% silane addition on the stress/strain behaviour of a Versamid 125/Epikote 828/glass microballoon syntactic foam. Figure 8. The effect of 2 wt% silane addition on the stress/strain behaviour of a Versamid 125/Epikote 828/glass microballoon syntactic foam.
C5-C18 Butanediol succinate (Craig polyester) carbowax 1500, 1540, 4000, 4000 (dioleate), 4000 (monostearate), 6000, 20M, 20M-TPA ethylene glycol adipate Igepal series Ucon series Versamid series... [Pg.39]

Amides Carbowax 600 (on chromosorb T) diethylene glycol succinate ethylene glycol succinate neopentyl glycol sebacate versamid 900 SE-30 (methyl silicone phases)... [Pg.39]

The Versamid series of curing agents were the original and best known polyamide curing agents. Current commercial polyamide curing agents and their properties are shown in App. D. More recently developed polyamides provide lower viscosity, better compatibility with epoxy resins, and better cure profiles under adverse conditions. [Pg.96]

Versamid 115 Ancamide 115 High-viscosity liquid 60-100 RT several days to full cure can be cured at ET in 1-2 h at 100°C Elementis Air Productions and Chemicals... [Pg.482]

Versamid 140 Low-viscosity liquid 30-70 RT several days to Elementis... [Pg.483]

Lubkowitz [76] used ethyl trifluoroacetate for the preparation of TFA derivatives of 1,2-diaminocyclohexane in order to avoid the unpleasant properties of anhydride, such as its high reactivity, and the formation of a corrosive by-product. A three-fold excess of the reagent in anhydrous medium in the presence of ammonia leads to a yield of up to 99%. He resolved cis- and trans-isomers of 1,2-diaminocyclohexane on Versamide 900 stationary phase. [Pg.98]

The analysis was performed, e.g., on 20% Versamid 900 on Gas-Chrom Q. Substances that provide the same hydrolysis products with the use of this procedure cannot be resolved and confusion with organic phosphates can also occur. In order to avoid these difficulties, simultaneous conversion into methyl and ethyl esters is performed. [Pg.179]

Polystyrene Although polystyrene is usually bonded by solvent cementing, it can be bonded with vinyl acetate/vinyl chloride solution adhesives, acrylics, polyurethanes, unsaturated polyesters, epoxies, urea-formaldehyde, rubber-base adhesives, polyamide (Versamid-base), polymethylmethacrylate, and cyanoacrylates. The adhesives should be medium-to-heavy viscosity and room-temperature and contact-pressure curing. An excellent source is a Monsanto Company technical information bulletin which recommends particular commercial adhesives for bonding polystyrene to a number of different surfaces. Adhesives are recommended in the fast-, medium-, and slow-setting ranges (10). [Pg.273]

Weeks et al. compared the separation of nicotine, nornicotine, myosmine, anabasine and anatabine on three gas chromatographic packed columns using SE-30, Versamid and DC 550 as stationary phases. Relative retention times, effective plate values and resolution are listed in Table 5.5. [Pg.36]


See other pages where Versamides is mentioned: [Pg.85]    [Pg.236]    [Pg.189]    [Pg.686]    [Pg.66]    [Pg.120]    [Pg.148]    [Pg.149]    [Pg.94]    [Pg.178]    [Pg.131]    [Pg.630]    [Pg.23]    [Pg.715]    [Pg.2272]    [Pg.37]    [Pg.37]    [Pg.37]    [Pg.37]    [Pg.245]    [Pg.208]    [Pg.267]    [Pg.309]    [Pg.464]    [Pg.945]    [Pg.232]    [Pg.180]    [Pg.509]   
See also in sourсe #XX -- [ Pg.1003 ]




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