Using Polymer Adhesive Bonding

FIGURE 15.14 Void-free fill of a via using CVD copper and liner (from Ref. 110). 

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Bonding of electronic components and parts may be metallurgical using solder, other metal alloys or eutectics, organic using polymer adhesives or vitreous using... 

Indirect bonding takes place with intermediate layer. The intermediate layer can be epoxies, photoresists, or other polymers depending on the type of substrate materials. A number of epoxies, UV-curable epoxies, and photoresists can be used for adhesive bonding. The advantage of polymers is the low process temperature requirement. The advantage of this bonding is that it can be used for all kinds of materials. 

The mechanisms of plastic deformation and creep under static load conditions in organic polymer materials such as adhesives are somehow different from that and need to he considered when using structural adhesive bonds in the presence of so-called dead loads which frequently may occur due to the mere influence of gravity of the mass of a certain structure. 

Emulsion Adhesives. The most widely used emulsion-based adhesive is that based upon poly(vinyl acetate)—poly(vinyl alcohol) copolymers formed by free-radical polymerization in an emulsion system. Poly(vinyl alcohol) is typically formed by hydrolysis of the poly(vinyl acetate). The properties of the emulsion are derived from the polymer employed in the polymerization as weU as from the system used to emulsify the polymer in water. The emulsion is stabilized by a combination of a surfactant plus a coUoid protection system. The protective coUoids are similar to those used paint (qv) to stabilize latex. For poly(vinyl acetate), the protective coUoids are isolated from natural gums and ceUulosic resins (carboxymethylceUulose or hydroxyethjdceUulose). The hydroHzed polymer may also be used. The physical properties of the poly(vinyl acetate) polymer can be modified by changing the co-monomer used in the polymerization. Any material which is free-radically active and participates in an emulsion polymerization can be employed. Plasticizers (qv), tackifiers, viscosity modifiers, solvents (added to coalesce the emulsion particles), fillers, humectants, and other materials are often added to the adhesive to meet specifications for the intended appHcation. Because the presence of foam in the bond line could decrease performance of the adhesion joint, agents that control the amount of air entrapped in an adhesive bond must be added. Biocides are also necessary many of the materials that are used to stabilize poly(vinyl acetate) emulsions are natural products. Poly(vinyl acetate) adhesives known as "white glue" or "carpenter s glue" are available under a number of different trade names. AppHcations are found mosdy in the area of adhesion to paper and wood (see Vinyl polymers). 

The method used to apply and dry a fixative affects the degree of stiffness and hold it imparts to the hairstyle. If appHed and then manipulated with a comb, bmsh, or fingers as the polymer forms its film, the adhesive bonds between the hair are broken, the film coating the hair is broken, and the end result is a soft feel with Htde set retention. If the fixative is allowed to dry undisturbed, then the result is a firmer feel and better hold. 

Butyl rubber (BR) and polyisobutylene (PIB) are widely used in adhesives as primary elastomeric binders and as tackifiers and modifiers. The main difference between these polymers is that butyl is a copolymer of isobutylene with a minor amount of isoprene (which introduces unsaturation due to carbon-carbon double bonds), while polyisobutylene is a homopolymer. 

Most rubbers used in adhesives are not resistant to oxidation. Because the degree of unsaturation present in the polymer backbone of natural rubber, styrene-butadiene rubber, nitrile rubber and polychloroprene rubber, they can easily react with oxygen. Butyl rubber, however, possesses small degree of unsaturation and is quite resistant to oxidation. The effects of oxidation in rubber base adhesives after some years of service life can be assessed using FTIR spectroscopy. The ratio of the intensities of the absorption bands at 1740 cm" (carbonyl group) and at 2900 cm" (carbon-hydrogen bonds) significantly increases when the elastomer has been oxidized [50]. 

These acids can be used alone or as mixtures. It is especially advantageous to use a mixture of liquid and gaseous acids. The gaseous acid will stabilize free monomer in the headspace of a container, while the liquid acid will prevent premature polymerization of the bulk monomer or adhesive. However, it is important to use only a minimum amount of acid, because excess acid will slow initiation and the formation of a strong adhesive bond. It can also accelerate the hydrolysis of the alkyl cyanoacrylate monomer to 2-cyanoacrylic acid, which inhibits the polymerization of the monomer and reduces molecular weight of the adhesive polymer. While carboxylic acids inhibit the polymerization of cyanoacrylate monomer, they do not prevent it completely [15]. Therefore, they cannot be utilized as stabilizers, but are used more for modifying the reactivity of instant adhesives. 

Cellulose is a high molecular weight polymer of D-glucose with fi( 1 -4)-glycosidic bonds, found in plant fibres it is the major component of most plant tissues. Starch is another common polysaccharide, containing two polymers of glucose, amylose and amylopectin. It was used in some paint preparations and in the production of paper. Acid treatment of starch produces dextrins, which are used as adhesives and additives in water colour paintings. 

Measurement of tensile or shear stress is the most commonly used in vitro method to determine bioadhesion. All in vitro measurements provide a rank order of bioadhesive strength for a series of candidate polymers. Measurement of tensile strength involves quantitating the force required to break the adhesive bond between the test polymer... 

The above concept of forming adhesive bonds in the solid state has been used to demonstrate the possibility of the parallel processing of a multi-chip module substrate, consisting of a multilayered polymer substrate with circuitry embedded on each polymer layer via lithographic processing [43], In this case, it is essential that the polymeric layer retains its dimensional stability so that registration and interconnections between the layers can be achieved using a Pb-Sn solder (see Fig. 28). A copolyester which appears to be ideally suited for this purpose is the 4/1 PHBA/BPT which melts at 320 °C in the randomized form... 

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