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Thin-film multilayer vacuum processes

The concept of modern multilayer packaging means that there is a minimum use of plastic material, because various characteristics can be combined into one thin packaging film. The most widely used plastic for combination is PE. The PA-PE combination processed by coextrusion has a good gas resistance. It can be deep drawn, and its fat resistance and IlexibiUty are suitable, too. These combinations are very widely used for vacuum packages. In addition, the PET-PE combination is heat resistant, and the PE-PP is sterilizable. As an illustration of the effectiveness of plastic composites, WilUams presents multilayer plastic... [Pg.246]

Ceramic capacitors are fabricated in four general processes thin-fihn, thick-film, single layer, and multilayer. Thin-fihn capacitors were developed out of a need to embed passive components into electronic packaging in hybrid circuits. Dielectrics such as SiO, SiOj, Ta20j, Ti02, titanates, and aluminosihcates can be vacuum deposited with a variety of electrode metallizations. [Pg.167]

See other pages where Thin-film multilayer vacuum processes is mentioned: [Pg.513]    [Pg.480]    [Pg.281]    [Pg.391]    [Pg.93]    [Pg.31]    [Pg.435]    [Pg.435]    [Pg.433]    [Pg.164]    [Pg.384]    [Pg.174]    [Pg.250]    [Pg.146]    [Pg.97]    [Pg.98]    [Pg.640]   
See also in sourсe #XX -- [ Pg.484 ]



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Thin-film processing

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