Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Thermal wave physical processes

Recent theoretical studies indicate that thermal fluctuation of a liquid/ liquid interface plays important roles in chemical/physical properties of the surface [34-39], Thermal fluctuation of a liquid surface is characterized by the wavelength of a capillary wave (A). For a macroscopic flat liquid/liquid interface with the total length of the interface of /, capillary waves with various A < / are allowed, while in the case of a droplet, A should be smaller than 2nr (Figure 1) [40], Therefore, surface phenomena should depend on the droplet size. Besides, a pressure (AP) or chemical potential difference (An) between the droplet and surrounding solution phase increases with decreasing r as predicted by the Young-Laplace equation AP = 2y/r, where y is an interfacial tension [33], These discussions indicate clearly that characteristic behavior of chemical/physical processes in droplet/solution systems is elucidated only by direct measurements of individual droplets. [Pg.176]

The physical means of defoaming involve foam breakdown by thermal treatment (heating, processing with overheated vapour, freezing), by acoustic (mainly ultrasound) waves, vibrations, a-particles irradiation, creation of high capillary pressure in the foam, etc. [Pg.611]

Figure 1 A schematic representation of the physical processes that occur during thermal-wave imaging. Figure 1 A schematic representation of the physical processes that occur during thermal-wave imaging.
Component spacing from the edge of the board is dictated by wave flows and the sur-ronnding structure. F. W. Kear s review of the thermal aspects of through-hole solder-joint formation offers a glimpse of the physical phenomenon of the wave-soldering process. [Pg.1108]

Sound and thermal wave generation can be theoretically described by classical disciplines of physics such as fluid mechanics and thermodynamics. The governing physical laws are the energy, momentum and mass conservation laws, given in the form of the heat-diffusion, Navier-Stokes and continuity equations, respectively. The physical quantities characterizing the PA and photothermal (PT) processes are the temperature T, pressure P (mechanical stress in case of... [Pg.653]

Waves of chemical reaction may travel through a reaction medium, but the ideas of important stationary spatial patterns are due to Turing (1952). They were at first invoked to explain the slowly developing stripes that can be exhibited by reactions like the Belousov-Zhabotinskii reaction. This (rather mathematical) chapter sets out an analysis of the physically simplest circumstances but for a system (P - A - B + heat) with thermal feedback in which the internal transport of heat and matter are wholly controlled by molecular collision processes of thermal conductivity and diffusion. After a careful study the reader should be able to ... [Pg.264]

The next important step in the elucidation of the role of the thermal factor in the mechanism of the phenomena in question was studying the effect of the sample size on the characteristics of the autowave process. Can the self-sustained wave regime of conversion be made impossible by intensification of heat release at the expense of a decrease in the diameter of a cylindrical sample containing the reactant mixtures By analogy with combustion physics, the question of a critical sample size has been raised. [Pg.355]

The slower autowave process is similar in some respects to classical combustion, despite the differences in their physical nature. The wave velocity shows the same dependence on thermal conductivity as in the case of flame propagation. Analogously to combustion, the reaction zone is near the maximum temperature Tm [it is near Tm that the critical gradient (dT/dx) switching on the reaction is realized], whereas the greater part of the front... [Pg.359]

It is demonstrated that when the NS concentration in the material decreases, thermal capacity goes up which is confirmed by the results of previous investigations. Thermal conductivity decline, when the NS concentration decreases, is apparently caused by the material defectiveness When Cu/C nanocomposites are introduced into the modified material, the NS can be considered as the generator of molecules excitation, which results in wave process in the material. It is found that polycarbonate modification with metal/carbon containing nanocomposites results in the changes in polycarbonate structure influencing its optical and thermal-physical properties. [Pg.242]

The rate of heat transfer in a thermal gradient is lower than might be expected for transport of vibrational energy heat transport by conductivity is much slower than sound propagation. The accepted physical model for heat transfer is a process of diffusing phonons (wave packets in the vibrating lattice) heat conduction in solids and in fluids is observed to be diffusive. [Pg.160]

TS involves the measurement of the sound intensity emitted by a sample as a function of temperature. Sound emission originates from the release of thermal stresses in the sample, such as movement of dislocations, generation and propagation of cracks, nucleation of new phases, relaxation processes, and discontinuous changes in physical properties. For example, at a glass transition temperature, a discontinuous change in free volume generates elastic waves... [Pg.4780]

In the surface mount assembly process, type 11 and type III boards will always require adhesive to mount the SMDs for passage through the solder wave. This is apparent when one envisions components on the bottom side of the substrate with no through hole leads to hold them in place. Adhesives will stay in place after the soldering process and throughout the fife of the substrate and the product, since there is no convenient means for adhesive removal once the solder process is complete. Additionally, adhesives can be used to enhance both thermal and electrical conduction between device features and board features. This means use of an adhesive must consider a number of both physical and chemical characteristics ... [Pg.1306]


See other pages where Thermal wave physical processes is mentioned: [Pg.471]    [Pg.77]    [Pg.505]    [Pg.78]    [Pg.195]    [Pg.128]    [Pg.185]    [Pg.237]    [Pg.289]    [Pg.104]    [Pg.374]    [Pg.289]    [Pg.194]    [Pg.16]    [Pg.231]    [Pg.30]    [Pg.55]    [Pg.211]    [Pg.159]    [Pg.379]    [Pg.2971]    [Pg.552]    [Pg.265]    [Pg.509]    [Pg.46]    [Pg.302]    [Pg.299]    [Pg.328]    [Pg.211]    [Pg.899]    [Pg.196]    [Pg.739]    [Pg.569]    [Pg.271]    [Pg.418]    [Pg.796]    [Pg.135]    [Pg.173]    [Pg.1305]   
See also in sourсe #XX -- [ Pg.255 ]




SEARCH



Physical processes

Physical processing

Thermal physics

Thermal processes

Thermal wave

© 2024 chempedia.info