The Device Applications

This chapter deals with the selective preparation, TEM/EXAFS/XPS characterization and catalysis of mono- and bimetallic nanowires and nanoparticles highly ordered in silica FSM-16, organosilica HMM-1 and mesoporous silica thin films. The mechanism of nanowire formation is discussed with the specific surface-mediated reactions of metal precursors in the restraint of nanoscale void space of mesoporous silica templates. The unique catalytic performances of nanowires and particles occluded in mesoporous cavities are also reviewed in terms of their shape and size dependency in catalysis as well as their unique electronic and magnetic properties for the device application. 

The synthesis of materials for device applications has very different requirements. Here, the most important questions are What does the device do and what factors will affect its performance The magnitude of the desired optical nonlinearity will always be one of many criteria that will ultimately dictate the material of choice. In many instances the magnitude of the nonlinearity will not be the most important parameter. Depending on the device applications, other considerations such as optical transparency, processability, one- and two-photon optical stability, thermal stability, orientational stability, and speed of nonlinear response will all be important. Our current understanding of NLO materials suggests that these variables are frequently interrelated and that there is often no ideal NLO material. The material of preference for a given application will typically be one that is the best compromise for a variety of variables. Tutorials by G. Stegeman and R. Zanoni, and by R. Lytel outline some of the NLO device applications and the related materials issues. 

The J- and H-aggregates have been found to possess the usefulness according to their respective aggregates for the device applications [70-73,75,76], Therefore, studies on the control of the dye aggregate formation and the formation mechanism of their aggregates in thin films are of great importance for practical use as well as for basic research of assembled dye molecules to understand their phenomena. 

Summarizing the obtained results we may conclude that the resistivity of SiC substrate has the most significant impact on morphology of the forming porous layer. Thus, further processing the porous layer for use in the device applications must take into account the resistivity of SiC substrate as well as other parameters of the anodization process. 

Silicon carbide (SiC) is an attractive semiconductor material for high temperature electronic and electro-optic applications. From the device application point of view the thermal conductivity of SiC exceeds that of copper, BeO, A1203 and AIN. The actual value of the thermal conductivity can be varied with polytype and/or doping [1,2]. 

Films, Laminates, and Coextrusions. Many films are used in medical device packaging applications. Both flexible formed and nonformed pouches, as well as bags, use films for their manufacture. These materials offer a high degree of versatility and are available in a countless variety of forms in monofilms, laminations, and coextrusions. The specific material to be used for a medical device is dependent upon the performance properties required for the device application. For example ... 

Stephan Kirchmeyer and colleagues, in Chapter 14, start the device application part of the book, through the introduction of the most industrially important conjugated polymer, PEDOT and showing a wide variety of its applications, such as transparent conductors, antistatic coatings, hole-injecting layers for OLEDs and photovoltaics. 

Currently, descriptions of components and devices are very heterogeneous. For devices, first classification standards, like eCl ss, exist to provide device type classifications following the functional requirements (like servo-stepper motor or a pointed profile mill) and device properties that enable the evaluation of the device application range (e.g., maximal torque of a motor or the maximum cutting depth and the cutting diameter of the profile mill). Even through the existence of first component models towards classification standards, there is no commonly accepted classification of components available. Examples of available models are eCl ss or vendor-dependent classifications, such as the drive chain classification of Lenze... 

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