Substrates for Hybrid Integrated Circuits

Substrate material Price per unit area (arb. units) Dielectric permittivity of insulator Maximum working temperature (K) Resistivity of dielectric layer (fl-cm) Density (g/cm3) Linear expansion coefficient x i r6(K ) Thermal conductivity [W/(m -K)] 

Tct is seen to increase with pore density and pore radius. However, a problem appears at a porous substrate when thin films are to be deposited during metallization to form interconnections, thin-film capacitors, etc.335 Sputtered material falls deep into the pores, which affects the planarity of the deposited layer and the electrical resistivity of the oxide layer underneath.335 To cope with this effect, the porous oxide should be padded by inorganic (A1203 and Si02) or organic (polyimide, negative photoresist) layers. 

Aluminum plates covered by anodic oxides are also used in manufacturing magnetic recording disks.336 337 

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