Structure factor silicon semiconductors

Typical results for a semiconducting liquid are illustrated in figure Al.3.29 where the experunental pair correlation and structure factors for silicon are presented. The radial distribution function shows a sharp first peak followed by oscillations. The structure in the radial distribution fiinction reflects some local ordering. The nature and degree of this order depends on the chemical nature of the liquid state. For example, semiconductor liquids are especially interesting in this sense as they are believed to retain covalent bonding characteristics even in the melt. 

Interconnect. Three-dimensional structures require interconnections between the various levels. This is achieved by small, high aspect-ratio holes that provide electrical contact. These holes include the contact fills which connect the semiconductor silicon area of the device to the first-level metal, and the via holes which connect the first level metal to the second and subsequent metal levels (see Fig. 13.1). The interconnect presents a major fabrication challenge since these high-aspect holes, which may be as small as 0.25 im across, must be completely filled with a diffusion barrier material (such as CVD titanium nitride) and a conductor metal such as CVD tungsten. The ability to fill the interconnects is a major factor in selecting a thin-film deposition process. 

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