Solder wave soldering

Pb-free wave-solder joint appearance snch as dniler solder joints Just as in reflow soldering, wave-soldered joints tend to be duller than those obtained from eutectic Sn-Pb.This is not a defect but a reality. [Pg.1113]

Reflow solder Wave solder Component finish or I/O Board finish Component internal... [Pg.26]

Generalized time and temperature parameters have been identified for a number of Pb-Sn solder assembly processes. Those parameters are listed below for reflow furnace soldering, vapor phase soldering, wave soldering, and hand soldering. [Pg.192]

The third process that was developed for Pb-Sn eutectic and near-eutectic solders is referred to as wave soldering. Wave soldering was developed as a large-volume process for through-hole printed wiring assemblies it continues to be used for mixed assemblies that have both through-... [Pg.193]

While the specific pad finish selected depends on the application conditions, it must exhibit a robust mechanical and thermal fatigue resistance. The selection of a solderable metal finish may however drive the failure mechanism within the solder from bulk fatigue to brittle interfacial failure, as could occur within the nickel-gold system [15]. There are several different ways to deposit a solder wettable finish on copper a chip carrier. For solder leveling, a simple dip, molten stream, or solder wave (solder fountain) can be used. A solder wave or fountain pumps a liquid stream of solder onto the board surface which coats all exposed metal surfaces. Three plating methods are used to deposit Ni, Au, Cu, Pd, Sn, and Ag onto metal surfaces used in the electronics... [Pg.510]

Most commercial wave soldering machines have a preheating section before the PCB or assembly is immersed into the solder wave, the thermal shock is reduced As the ambient temperature has already been raised before the solder wave, the thermal gradient in the reed switch seal is reduced. [Pg.130]

Resins are used in electromc/electncal applications (connectors, circuit boards that are vapor and wave solderable, microwave transparent radomes, integrated circuit chip carriers, miniature switches, explosion proof enclosures, lamp reflectors, and high-precision fiber optic components). Polyetherimide is used for medical components (hat require all forms of sterilization. Other uses are found in the transportation field, dual-ovenable cookware, as well as bearings, fasteners, and advanced composites. [Pg.1338]

Thin ( 2 /mi) layers of nickel and tin are electroplated over the silver termination, the former to act as a barrier preventing dissolution of the silver during the subsequent wave-soldering operation when the chips are surface-mounted onto a substrate. The tin layer ensures good wetting of the termina tion by the solder. In the case of the BME capacitor (see below) the termination is copper fired on under reducing conditions and covered with an electroplated layer of nickel. [Pg.266]

Circuit Board SMD and Wave Frame Soldering Assembly... [Pg.291]

However, up to now, most flexible circuit boards have been based on either polyester or polyimide. While polyester (PET) is cheaper and offers lower thermal resistance (in most cases reflow soldering with standard alloys is not possible), polyimide (PI) is favored where assemblies have to be wave or reflow soldered (with standard alloys). On the other side, the relative costs for polyimide are 10 times higher than for polyester. Therefore, a wide gap between these two dominant materials has existed for a long time, prohibiting broad use of flexible circuits for extremely cost-sensitive, high-reliability applications like automotive electronics. Current developments in the field of flexible-base materials as well as the development of alternative solder alloys seem to offer a potential solution for this dilemma. [Pg.424]

The mounting of SMD components onto PCBs or flexible substrates demands a certain amount of interconnection material (solder or conductive adhesive) to form a correct joint. In contrast to wave soldering, where heat and material (molten solder) are provided simultaneously during the soldering... [Pg.424]

Flow soldering, see Wave soldering Flow time, determination of, 1631 Fluid-flow switches, 1902... [Pg.2731]

Clean Water Act, 595 water permits, 596 Water systems, 1581 Wave soldering, 423, 424, 429 WBS, see Work breakdown structure WBT (Web-based training), 940 Wealth, creation vs. preservation of, 755 Web-based procurement, 262-263 Web-based programming, 76-79 Web-based training (WBT), 940 Web browsers, 240, 244-245 Web pages, 245 Web security protocols, 734 Web servers, 256 Active Server Pages, 79 application program interfaces, 78 Web stores, 262... [Pg.2794]

Surface-mount technology replaces previous methods of inserting component leads into plated through-holes of PWBs, wave soldering from the back side to flow solder into the holes, and simultaneously forming both mechanical and electrical connections. SMT is highly automated and currently the most widely used production process for the assembly of single-layer, double-sided, and multilayer circuit boards. [Pg.10]

Figure 5.1 Representation of SMT for (a) wave soldering and b) reflow soldering.

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