Solder compounds

Use Hot-melt and pressure-sensitive adhesives, mastics and sealants, varnishes, ester gum, soldering compounds, core oils, insulating compounds, soaps, paper sizing, printing inks, polyesters (formed by reaction of the conjugated acids of rosin with acrylic acid, followed by reaction with a glycol). 

The hard solder compounds also investigated in [30] showed a loss in adhesion between the solder and steel in the case of the ferritic Cr steels, that is to say knifeline corrosion occurred. It is possible to use a solder which contains 56 % Ag, 26 % Cu, 14 % In and 4 % Ni on austenitic CrNi steels. Solders containing Zn could not be used because of dezindfication at the steel/solder phase boundary. 

In another study on hard solder compounds, it was found that the silver hard solder L-Ag 40 Cd proved to be resistant in association with the steel 1.4301 in hot water containing up to 50 mg/1 chloride [32]. 

Soldering over gold should be avoided whenever possible. Where necessary, care should be taken to minimize the formation of brittle gold solder compound by one or more of the following methods ... 

CoF is used for the replacement of hydrogen with fluorine in halocarbons (5) for fluorination of xylylalkanes, used in vapor-phase soldering fluxes (6) formation of dibutyl decalins (7) fluorination of alkynes (8) synthesis of unsaturated or partially fluorinated compounds (9—11) and conversion of aromatic compounds to perfluorocycHc compounds (see Fluorine compounds, organic). CoF rarely causes polymerization of hydrocarbons. CoF is also used for the conversion of metal oxides to higher valency metal fluorides, eg, in the assay of uranium ore (12). It is also used in the manufacture of nitrogen fluoride, NF, from ammonia (13). 

Only about 10 elements, ie, Cr, Ni, Zn, Sn, In, Ag, Cd, Au, Pb, and Rh, are commercially deposited from aqueous solutions, though alloy deposition such as Cu—Zn (brass), Cu—Sn (bronze), Pb—Sn (solder), Au—Co, Sn—Ni, and Ni—Fe (permalloy) raise this number somewhat. In addition, 10—15 other elements are electrodeposited ia small-scale specialty appHcations. Typically, electrodeposited materials are crystalline, but amorphous metal alloys may also be deposited. One such amorphous alloy is Ni—Cr—P. In some cases, chemical compounds can be electrodeposited at the cathode. For example, black chrome and black molybdenum electrodeposits, both metal oxide particles ia a metallic matrix, are used for decorative purposes and as selective solar thermal absorbers (19). 

Includes paints and poHshes, antiknock and other compounds, soldering and/or welding, electrical and electronic products, mechanical products, magnetic tape, small packages, industrial diamonds, and drilling mud. 

Union Carbide Corp. Parylene conformal coatings, photoresists, developers, etchants, solder masks, potting compounds... 

Mercury is used in the manufacture of thermometers, barometers and switchgear, and in the production of amalgams with copper, tin, silver and gold, and of solders. A major use in the chemical industry is in the production of a host of mercury compounds and in mercury cells for the generation of chlorine. Mercury has a significant vapour pressure at ambient temperature and is a cumulative poison. 

Although inhibitors are deliberately added to the silicone formulation to control cure rate, unwanted cure inhibition can be caused by other species that react to form strong complexes with the platinum catalyst. Most notable of these undesired inhibitors include organotin and other organometallic compounds, sulfur, polysulfides, polysulfones or other sulfur-containing materials, amines, urethanes or amine-containing materials, unsaturated hydrocarbons in plasticizers, and some solder flux residues. 

The compound MgGa204, when activated by divalent impurities such as Mn +, is used in ultraviolet-activated powders as a brilliant green phosphor. Another very important application is to improve the sensitivity of various bands used in the spectroscopic analysis of uranium. Minor uses are as high-temperature liquid seals, manometric fluids and heat-transfer media, and for low-temperature solders. 

The main use of elemental As is in alloys with Pb and to a lesser extent Cu. Addition of small concentrations of As improves die properties of Pb/Sb for storage batteries (see below ), up to 0.75% improves the hardness and castabilily of type metal, and 0 5-2.0% improves the sphericity of Pb ammunition. Automotive body solder is Pb (92%),, Sb (5 0%), Sn (2.5%) and As (0.5%). Intcrnxitallic compounds with Al, Ga and In give the 111-V semiconductors (p 255) of which GaAs and InAs are of particular value for light-emitting diodes (LEDs), tunnel diodes, infrared emitters, laser windows and Hall-effect devices (p. 258). 

Solders are anodic to copper, but soldered joints in copper pipes are widely used without trouble for cold supply waters possibly corrosion is restricted by the deposition of cathodic carbonate scales and the formation of insoluble lead compounds. Hot supply waters tend to be more aggressive and, where these are involved, it is wise to tin any copper which has a soldered joint. Electrolytes of high conductivity such as sea-water will also attack soldered joints in copper. 

---