SIP packaging

When a circuit needs to be removable, there are several ways of designing it. One of the first ways was with the Single Inline Package (SIP). SIPs are characterized by a small circuit board with several small pins coming out of it (see Figure 1.8) the SIPs are plugged into corresponding holes or mounts in a circuit board. SIPs are not used much anymore, primarily because of the tendency of the pins to break. SIPs were often used for memory modules. 

Single Inline Package (SIP) A type of semiconductor package where the package has a single row of connector pins on one side only. 

M. Kada. The dawn of 3-D packaging a system-in-package (SIP). Sharp Electronics Corp. White Paper, [online]. Available http //www.sharpsma.com/pub/productfocus/publications/ memory/tec whitepaper dawn of 3-D pkgs.pdf. 

Many other variations of DIP technology are readily available, such as SH-DIP (shrink DIP), SIP (single in-line package), SOP (small outline package), and QFP (quad flat package, as shown in Fig. lb (courtesy of Shinko Electric Industries Co. Ltd.)). The basic techniques are the same as DIP, but the variants provide different form factors and different arrangements of the pins. 

Flat SIP, a single inline package except the leads have a 90° bend. 

More functionality is achieved by further adding one or more ICs to the module. Fully functional blocks in one package are referred to as system-in-packages (SiPs). A vision of this is depicted in Figure 9.1. 

Packaging for integrated electrical optical functions, system-in-package (sip)... 

Polysulfone s capability to act as a matrix for PDLCs was tested for three distinct nematic liquid crystals, with the goal of proposing materials for application as smart packaging (Marin and Perju 2008, 2009, 2010 Perju et al. 2011, 2015). The polysulfone-based PDLCs were obtained by combining the SIPS and TIPS (thermal treating by heating/cooling between RT and Tg of the polysulfone) methods. 

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