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System-in-Package SIP

Package Size, ntnt I/Os Substrate Number of Passive Devices Number of ICs Number of Flip Chip [Pg.329]

M. Kada. The dawn of 3-D packaging a system-in-package (SIP). Sharp Electronics Corp. White Paper, [online]. Available http //www.sharpsma.com/pub/productfocus/publications/ memory/tec whitepaper dawn of 3-D pkgs.pdf. [Pg.160]

More functionality is achieved by further adding one or more ICs to the module. Fully functional blocks in one package are referred to as system-in-packages (SiPs). A vision of this is depicted in Figure 9.1. [Pg.363]

Packaging for integrated electrical optical functions, system-in-package (sip)... [Pg.495]

FIGURE 58.5 System-in-Package (SiP) Module. SiP modules help reduce signal delay between a processor and the memory devices it communicates with. This SiP has one processor in the middle, surrounded by four discrete memory packages, all on one module. The module is soldered to the PWB via the solder balls on the back side of the module substrate. [Pg.1368]

SINGLE-IN-LINE PACKAGE (sip) Component package system with one line of connectors, usually spaced 0.100 in apart. [Pg.1617]

See other pages where System-in-Package SIP is mentioned: [Pg.432]    [Pg.217]    [Pg.260]    [Pg.260]    [Pg.158]    [Pg.326]    [Pg.326]    [Pg.328]    [Pg.328]    [Pg.1368]    [Pg.432]    [Pg.217]    [Pg.260]    [Pg.260]    [Pg.158]    [Pg.326]    [Pg.326]    [Pg.328]    [Pg.328]    [Pg.1368]    [Pg.384]    [Pg.440]    [Pg.73]    [Pg.87]    [Pg.1014]    [Pg.1250]    [Pg.235]    [Pg.333]   


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