Silicon carbide circuits

ANSI/IEEE-C62.1/1994 Standard for gapped silicon carbide surge arresters for a.c. power circuits ... 

Power efficiency, 24 843 Power Electronic Building Block (PEBB) program, 24 390, 398-399 Power electronic circuits, silicon carbide in, 22 539-540... 

Other solid-state applications of silicon carbide include its use as an electroluminescent diode for use in sound recording equipment and photomultipliers and controllers. It has been studied as a reflective surface for lasers. By combining its excellent thermal conductivity and high electrical resistance, silicon carbide has also found application as an insulating material for integrated circuit substrates. 

Silane [7803-62-5] - [INTEGRATED CIRCUITS] (Vol 14) - [ELECTRONICMATERIALS] (Vol 9) -laser-induced photolysis [LASERS] (Vol 15) -production of silicon carbide [ADVANCED CERAMICS - STRUCTURALCERAMICS] (Voll)... 

A. Elasser, T.P. Chow, Silicon carbide benefits and advantages for power electronics circuits and systems, Proc. IEEE 90 (2002) 969—986. 

Boiling water acts as coolant and moderator, while separated steam is used to drive the turbine. Maintenance of the water chemistry is performed by the systems that are conventional for reactors of BWR type. The coolant circuit equipment is made of stainless steel, or has a welding deposition made of stainless steel. The fuel assemblies are also made of stainless steel. The outer coatings of micro fuel elements are made of silicon carbide (SiC). 

Glass, carbon, and the aramids are the most common fiber reinforcements incorporated into polymer matrices. Other fiber materials that are used to much lesser degrees are boron, silicon carbide, and aluminum oxide tensile moduli, tensile strengths, specific strengths, and specific moduli of these materials in fiber form are given in Table 16.4. Boron fiber-reinforced polymer composites have been used in military aircraft components, helicopter rotor blades, and sporting goods. Silicon carbide and aluminum oxide fibers are used in tennis rackets, circuit boards, military armor, and rocket nose cones. 

Transition metal carbides can be used as diffusion barriers like transition metal nitrides in multilayer metallization schemes for integrated circuits. Layers on the order of lOOnm are applied and are produced by sputtering methods. The high chemical stability of these transition metal carbides, especially those of group 4, are exploited to prevent interaction of metal or component layers such as silicon, aluminum, and silicides upon thermal load in production processes. This load would cause electrical or even structural deterioration of the multilayer packages. 

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