Sensitive materials processing

When the dryer is seen as a heat exchanger, the obvious perspective is to cut down on the enthalpy of the air purged with the evaporated water. Minimum enthalpy is achieved by using the minimum amount of air and cooling as low as possible. A simple heat balance shows that for a given heat input, minimum air means a high inlet temperature. However, this often presents problems with heat-sensitive material and sometimes with materials of constmction, heat source, or other process needs. AH can be countered somewhat by exhaust-air recirculation. 

Soluble impurities can be extracted by washing with deionized or distilled water foUowed by filtration (1,12,26). Powders prepared by wet chemical synthesis are often washed and filtered for purification prior to use. The dewatering (qv) process can be enhanced by pressure filtration. Organic solvents can be used to remove water-insoluble impurities and wash-water sensitive materials. 

Liquids. Liquids (33) are common forming additives in plastic, paste, and slurry processing. In plastic forming operations, the Hquid aids forming and serves as the binder/plasticizer for the system. In pastes and slurries, other additives are also dissolved or dispersed in the Hquid/solvent. Water is a good, inexpensive solvent that can be recycled. Organic Hquids such as alcohols are used to process water-sensitive materials and to dissolve water-insoluble forming additives, however, at considerably more expense. 

Comparison Data—Plate Dryers Comparative studies have been done on products under both atmospheric and vacuum drying conditions. See Fig. 12-79. These curves demonstrate (1) the improvement in drying achieved with elevated temperature and (2) the impact to the drying process obtained with vacuum operation. Note that cui ve 4 at 90°C, pressure at 6.7 kPa absolute, is comparable to the atmospheric cui ve at 150°C. Also, the comparative atmospheric cui ve at 90°C requires 90 percent more diying time than the vacuum condition. The dramatic improvement with the use of vacuum is important to note for heat-sensitive materials. 

Select a process chemistry that is inherently safer (e.g., replace shock sensitive, high temperature sensitive and high pressure sensitive materials with more benign materials, less severe operating conditions)... 

Viscosity is more temperature sensitive with material processed closer to their 7g, for example poly(methyl methacrylate), compared with nylon 6. 

This technique is used for the production of radiation-cured coatings, adhesives, and inks. The process is not accompanied by the release of heat, which is particularly important in the case of heat-sensitive materials, e.g., wood, cardboard, paper, plastics, etc. Various radiation sources are used for this technique, among which UV and EB are most useful. 

Evaporation, Heat exchange, condensing vapours U.sually not May become necessary when processing thermally sensitive materials or if fouling of heat-transfer surfaces is possible. 

To date, we have exercised these materials in basically three types of multilayer lithographic applications (1) as short wavelength contrast enhancing layers, (2) as imagable 02-RIE resistant materials in bilayer processes and (3) as radiation sensitive materials for multilayer, e-beam processes. 

A variety of optical oxygen sensor systems have been developed for applications such as biomedical, environmental and process control . But very few of them have been critically assessed for their suitability for food packaging applications. It has been proven that substantial development, optimization and redesign of the oxygen-sensitive materials and fabrication processes are required for the oxygen sensors to match practical requirements for these applications5. In particular, specific requirements of food applications are ... 

Ionizing Air for Static Charge Neutralization While Processing Sensitive Materials... 

Polymer radiation chemistry is a key element of the electronics industry, in that polymer materials that undergo radiation induced changes in solubility are used to define the individual elements of integrated circuits. As the demands placed on these materials increases due to increased density, complexity and miniaturization of devices, new materials and chemistry will be required. This necessitates continued efforts to understand fundamental polymer radiation chemical processes, and continued development of new radiation sensitive materials that are applicable to VLSI Technology. 

Prefer fluidized granulator over high shear mixer granulator if better temperature control for processing heat-sensitive materials is desired. 

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