Bilayer processes

Fig. 35. Process flow for thin-film imaging lithography (a) bilayer process and (b) top surface imaging. The bilayer process shown here employs a positive-tone imaging layer. The TSI process illustrated refles on preferential silicon incorporation in the exposed regions of the imaging layer to give a...

To date, we have exercised these materials in basically three types of multilayer lithographic applications (1) as short wavelength contrast enhancing layers, (2) as imagable 02-RIE resistant materials in bilayer processes and (3) as radiation sensitive materials for multilayer, e-beam processes. 

Fig. 4. Polynucleotide array fabrication processes using polymeric photoresists. Left. A single layer resist process. Right A bilayer process using a protective underlayer...

Figure 1. A bilayer process for the production of high resolution images utilizing O2-RIE techniques for image transfer.

This section deals with process technologies associated with the bilayer process. Particular emphasis will be given to the development of an all-dry processing scheme including dry development and dry deposition of the Ag-compound sensitizing layer. 

Figure 3.37. Bilayer negative dry-development scheme. The SEM shows the final image obtained by the bilayer process with a Perkm-Elmer M500 in the UV-2 mode. Reproduced with permission from reference 127. Copyright 1985 Society of Plastics Engineers.)...

S. Birkle, Chemical amplification of resist lines a novel sub half micron bilayer resist technique for NUV and deep UV lithography, Proc. SPIE 1262, 528 (1990) M. Sebald, H. Berthold, M. Beyer, R. Leuschner, Ch. Ndlscher, U. Scheler, R. Sezi, H. Ahne, and S. Birkel, Application aspects of the Si CARL bilayer process, Proc. SPIE 1466, 227 237 (1991) R. Leuschner, M. Beyer, H. Bomdorfer, E. Kiihn, Ch. Nolscher, M. Sebald, and R. Sezi, CARL resist A technology for optical quarter micron resolution and below, in Proc. SPE Reg. Tech. Conf. Photopolym., Ellenville, NY, pp. 215 224(1991). 

FIGURE 5.47 Schematic of portable conformable mask (PCM) bilayer process. (PR, photoresist dUV, deep-UV). 

Pig. 8. Bilayer process for patterning polyamic acid films. 

Fig. 9. A stress buffer coat pattern formed in PMDA-ODA polyamic acid using the bilayer process shown in Figure 8. Courtesy of Arch Chemicals, Inc.

---