Semiconductor application, polyimide films

In order to develop polyimide films for semiconductor applications, many chemical, mechanical, thermal and film forming characteristics must be determined in order for the user to develop a viable process for reliable integrated circuits. 

Figure 6.6 shows a scheme of the CIELab system. Park and Chang [20] prepared some polyimide nanocomposites films with pristine clay and analyzed the transparency and color change. This is an important aspect since colorless polyimide films have in particular been widely used in electro-optical devices and semiconductor applications. The measurements were obtained for 80 pm thick films by a spectrophotometer and the color coordinates on CIELab system were determined. 

Du Pont produces this polymer under the trade names of Kapton, Pyrafin, Vespel, and Pyre-ML. The trade names refer to polyimides used for film, semiconductor coatings, mol ding applications, and wire enamel, respectively. They have exceUent thermal, electrical, and physical properties. 

Polvimide-Metal Interfaces. Several technological applications including semiconductor packaging and metallization demand a reliable and durable adhesion properties of the metal films. In the development of multilayer devices consist of alternating layers of metal and polyimides several reliable techniques are needed to study both thin films and their interfaces. The usefulness of the nuclear scattering techniques to study the metallization and the associated interfacial elemental diffusion processes under the effects of various temperature and humidity treatments on the metal-polyimide systems, such as Al, Cu, N, and Au on Du Pont Kapton type H have already been reported (21., 22.). Only a couple of examples are presented here to illustrate the ERD application. 

Polyimides have many applications in microelectronic industries. They are often used in the electronics industry for flexible cables, as friction elements in data processing equipment, and as insulating films on magnet wires. For example, in a laptop computer, the cable that connects the main logic board to the display (which must flex every time the laptop is opened or closed) is often a polyimide base with copper conductors. Polyimides are used as high-temperature adhesives in semiconductor industries and aerospace industries. They are used for the struts and chassis in cars as well as some... 

Figure 30 Main applications of adhesives in electronic and semiconductor industries (a) polyimide interlayer dielectric films in the fabrication of integrated circuits (b) die attachment in plastic packages (c) die attachment in ceramic packages (d) multichip module with flip chip and surface-mounted devices (e) flexible circuitry (f) tape automated bonding (g) liquid crystal display panels.

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