Selective electroless metallization

Electrochemical deposition for integrated circuits can be achieved through either electroless or electrodeposition. The feasibility of using selective electroless metal disposition for integrated circuit (IC) fabrication has been demonstrated by Ting et al. (21) and Shacham-Diamand (27). 

Wei CS, Fraser DB, Wu AT, Paunovic M, Ting CH. The use of selective electroless metal deposition for micron size contact fill. lEDM Technical Digest Dec 1988. p 446-449. 

C. H. Ting and M. Paunovic, Selective electroless metal deposition for integrated circuit, J. Elec-tmchem. Soc. 136, 456, 1989. 

It is also possible to fabricate elastomeric wires by selective electroless metallization of PDMS. ... 

Top-Surface Imaging Using Selective Electroless Metallization of Patterned Monolayer Films... 

Electroless plating. This process involves autocatalyzed decomposition or reduction of a few selected metastable metallic salt complexes on substrate surfaces. The reaction should be carefully controlled to avoid potential decomposition of the metal film thus formed and to control the film thickness. The induction period of the reaction can be appreciable and an effective way of reducing the period is to preseed the substrate in advance with nuclei of the metal to be deposited in an activation solution [Uemiya et al., 1990]. 

Selective electroless nickel plating of particle arrays on polyelectrolyte multilayer was investigated for the potential applications in sensors, optoelectronics, and biochips.96 This process is based on the preparation of functional colloidal arrays on surfaces. In the next step metal deposition is carried out on the surfaces of the patterned particles secured on the substrate. Samples of colloidal arrays on patterned polyelectrolyte templates are first pretreated with a Pd(II)-based catalyst. After rinsing with deionized water and drying, samples were plated with nickel using dimethylamine borane (DMAB) as a reducing agent. Based on the results of this work,96 it was shown that the selective electroless nickel deposition on 3D patterned surfaces can be successful. 

Selective electroless deposition of cobalt alloys offers a novel approach for forming self-aligned metallic cap layers. Such films have better adhesion to copper than dielectric films. 

Yasushi, O., Y. Shoji, and K. Masaki, 2004. Metal pattern formation by selective electroless metalli2ation on polypyrrole films patterned by photochemical degradation of iron (P) chloride as oxidizing agent. Synth Met 144 265. 

Peng K, Zhu J (2004) Morphological selection of electroless metal deposits on silicon in aqueous fluoride solution. Electrochimica Acta 49 2563-2568 Peng K, Yan Y, Gao S, Zhu J (2003) Dendrite-assisted growth of silicon nanowires in electroless metal deposition. Adv Funct Mater 13 127-132... 

Peng KQ, Zhu J (2004) Morphological selection of electroless metal deposits on silicon in aqueous fluoride solution. Electrochim Acta 49 2563-2568 Polisski S, Goller B, Lapkin A et al (2008) Synthesis and catalytic activity of hybrid metal/silicon nanocomposites. Phys Status Solidi RRL 2 132-134 Polisski S, Goller B, Heck SC et al (2011) Formation of metal nanoparticles in silicon nanopores plasmon resonance studies. Appl Phys Lett 98 011912 Renaux C, Scheuren V, Flandre D (2000) New experiments on the electrodeposition of iron in porous silicon. Microelectron Reliab 40 877-879 Ronkel F, Schultze JW, Arens-Fischer R (1996) Electrical contact to porous silicon by electrodeposition of iron. Thin Sohd Films 276 40—43... 

Asoh H, Sakamoto S, Ono S (2007c) Metal patterning on silicon surface by site-selective electroless deposition through colloidal crystal templating. J Colloid Interface Sci 316(2) 547-552... 

Selective electroless plating to fabricate complex three-dimensional metallic micro/nanostructures. 

Specific metallization processes are necessary for the selective deposition of metal coatings on structured thermoplastics. Wet-chemical metallization consists of pretreatment and activation of the plastic surface, followed by chemically reductive or electroless metallization. The systems of metal plating are similar to those... 

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