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Screening soldering

FIGURE 57.10 Transmitted light micrograph through a PCB that failed in the field. Dendritic growth has formed at the interface of a UV-cured screened solder mask and the FR-4 surface. [Pg.1327]

In the early 1970s, the first companies to apply low cost, mass production techniques to photovoltaics, a technology that had previously been considered an exotic aerospace technology, emerged. These techniques included the use of electroplated and screen printed metal paste electrical conductors, reflow soldered ribbon interconnects, and by 1977, low cost, automobile windshield-style, laminated module constmction. Such processes benefitted from a substantial existing industrial infrastmcture, and have become virtually ubiquitous in the present PV industry. [Pg.470]

Tonic is a three-story industrial space with steel catwalks, a stone bar lighted blue beneath it, flat-screen televisions and blue tufted clamshell banquettes against one wall for diners—a lounge made from parts, several nightlife trends of the last several years, soldered together. [Pg.46]

A screening study for evaluating and selecting components of the tinplate container—tinplate, enamel, end-sealing compound, and side-seam solder—which were irradiated at designated doses and temperatures... [Pg.30]

Remove the reducer and press the screen disk into its mouth. Solder in place. [Pg.61]

After the sintering stage, electrodes are applied, usually either by electroless nickel plating or by painting or screening on specially adapted silver paint. Leads are then soldered to the electrodes when, for many applications, the device is complete in other cases it may be encapsulated in epoxy or silicone resins. Examples are illustrated in Fig. 4.15. [Pg.171]

Figure 12. X-ray radiograph of section of the wall of the Hu shown in Figure 11. From the evidence seen in this radiograph—square and rectangular supports behind each figure, the white spots on or near each rod (solder), and dark areas (voids in metal) around each figure—the casting procedure described in the text can be deduced. Exposure 275 kV, 4 mA, lead screens. Figure 12. X-ray radiograph of section of the wall of the Hu shown in Figure 11. From the evidence seen in this radiograph—square and rectangular supports behind each figure, the white spots on or near each rod (solder), and dark areas (voids in metal) around each figure—the casting procedure described in the text can be deduced. Exposure 275 kV, 4 mA, lead screens.
During a run, the gas flowed down between the gear teeth to the center of the rod, and then through an 2ixial hole in the rod to enter the boat. Screens of 200-mesh were soldered across the ends of the center holes in the rods to prevent catalyst fines from being blown upward out of their boat. These screens also served to center the basket in the boat containing the full-size pellets. [Pg.54]

Install the baffle assembly into the outer tube. The front baffle (end cap) should be recessed about 1/16 inch. The spaces between the washers mav be filled with steel wool or rolls of brass screen before Installing in the outer tube. Thte is optional aa there Is some disagreement about the value of these materials as baffling devices. Solder the baffle assembly in place. [Pg.12]

After extensive use, the silencer should be disassembled and cleaned. The screen should be scrubbed clean or replaced, as well as the baffles in the endcap. Be sure to Inspect the spiral baffle assembly for any breaks in the soldered washer spiral, and resolder them. [Pg.60]

Fluorescent inspection oil Fluxes bracing, soldering, galvanizing, and welding Foam charge mixtures Food contamination testing and screening kits... [Pg.477]

The effect of temperature and humidity on the insulation resistance of photopolymerized and thermally cured solder masks was determined. Dry film and screen ink solder masks were applied to a test pattern. The insulation resistance of the coated test pattern decreased with exposure to elevated temperature and humidity. Elevated temperature alone, however, had only a small negative affect on the insulation resistance. [Pg.367]

Ultraviolet light (UV) curable screen ink solder masks and photopolymerizable dry film solder masks have been available commercially since 1973 (5). These materials offer the PCB manufacturer many processing and production advantages relative to the conventional solvent-evaporative thermally cured solder masks. These products based on a new emerging technology have helped... [Pg.367]

CN. [Sartomer] Epoxy, polybutadiene, and urethane acrylates and blends for paper clear coadngs, wood tq> coatings, screen inks, litho inks, pdyethyl-ene coadngs, metal decoradve coatings, adhesive papers, wood fillers, solder masks and photoresists. [Pg.80]

The main advantage of stencil printing over screen printing occurs in applications where very small areas of paste have to be deposited. For components with pitches equal to or smaller than 0.65 mm, the stencil printing process is the only viable way for printing solder paste. Therefore, stencil printing has replaced screen printing in most cases. [Pg.425]

Discrimination, price, 681-682 Diseases, occupational. See also Occupational safety and health definition of, 1168-1170 descriptions of, 1167, 1169-1170 statistics related to, 1157, 1173-1174 Dispatching, 1723-1725 basic rules, 1723-1724 composite rules, 1724-1725 first-come-first-served (FCFS), 1511-1513 major activities of, 1770 notation used in modeling of, 1719-1722 rules, dispatching, 1511, 1513 Dispensing (solder paste), 425, 426 Display systems, virtual environment, 2502 Distance, computer screen viewing, 1197 Distance learning, 940 Distributed commerce model, 271-272 Distributed component object model (DCOM), 721... [Pg.2723]

A screen was placed near the bottom of the dewar as a safety measure. If any of the glass measuring volume should happen to break inside the dewar the screen would protect the bottom of the dewar. The tube shown extending through the screen and out the pipe at the top was used to remove the liquid resulting from tests above the triple point or from the melted solid. A 5-/i screen was placed upstream of the orifice to filter out any foreign material. This screen was placed in a soldered union approximately 2 in. above the orifice. [Pg.294]


See other pages where Screening soldering is mentioned: [Pg.53]    [Pg.53]    [Pg.432]    [Pg.526]    [Pg.388]    [Pg.542]    [Pg.891]    [Pg.94]    [Pg.419]    [Pg.384]    [Pg.61]    [Pg.252]    [Pg.86]    [Pg.526]    [Pg.280]    [Pg.526]    [Pg.9]    [Pg.36]    [Pg.55]    [Pg.291]    [Pg.231]    [Pg.235]    [Pg.67]    [Pg.352]    [Pg.157]    [Pg.406]    [Pg.802]    [Pg.525]    [Pg.691]    [Pg.683]    [Pg.111]    [Pg.425]    [Pg.425]    [Pg.425]    [Pg.295]   
See also in sourсe #XX -- [ Pg.10 ]




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