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Room temperature cure adhesives

EA 9203 (b) EA 9602 and other epoxy adhesives 5-10 pm Air drying 60 min Corrosion-inhibiting for use with room temperature curing adhesives... [Pg.199]

Resolution Performance Products, Starting Formulations 4000 and 4001, Rapid Setting Room Temperature Cure Adhesive, Houston, TX, August 2003. [Pg.226]

Heat curing epoxy systems may consist of one or two components. The nomenclature is similar to that employed with the room temperature curing adhesives (e.g., resin component, curing agent component, 2Ksystem, etc.). Many heat curing epoxy adhesives systems are liquids or pastes. However, heat curing systems also can be processed into solid adhesive forms (e.g., powders and films). This chapter describes the paste and liquid formulations solid adhesive forms are considered separately in Chap. 13. [Pg.227]

Greater internal stresses than in room temperature curing adhesive because of... [Pg.228]

Although room temperature curing epoxy adhesive can also be cured at elevated temperatures, there are important differences in morphology and internal stresses between a room temperature cured adhesive and a heat cured epoxy adhesive (see Chap. 3). One should not assume that the properties would be equivalent or better if the adhesive were cured at elevated temperature rather than room temperature. A number of factors need to be considered in such a deliberation. [Pg.228]

One of the advantages of using a two-component room temperature curing adhesive system is that induction curing can be used to spot-cure the adhesive in a joint (similar to a spot-welding process). The adhesive that is not spot-cured by induction will then fully cure at room temperature as the part moves down the assembly line. [Pg.276]

Heat curing adhesives are less sensitive to surface preparation than room temperature curing adhesives. [Pg.351]

Epoxies are especially reliable when used with epoxy-based composites because they have similar chemical characteristics and physical properties. Room temperature curing adhesives are often used to bond large composite structures to eliminate expensive fixtur-ing tools and curing equipment required of higher-temperature cure adhesives. However, room temperature epoxies require long cure times, so they are not suitable for large, highspeed production runs. Some of the lower-temperature composite materials are sensitive to the heat required to cure many epoxies. Epoxies are too stiff and brittle to use with flexible composites. [Pg.380]

Room-Temperature Curing Adhesives Based on Lignin and Phenoloxidases... [Pg.129]

Cold (at room temperature) curing adhesive systems have short pot lives (in the range of seconds, minutes, hours). [Pg.75]

Two of the three binder systems used by the foundry industry are two-component, room-temperature curing adhesives. All systems use polymeric MDI as the isocyanate component. All of the cross-linkable components are polyols. The first polyol introduced into the industry was an alkyd oil resin consisting of linseed oil, pentaerythritol and isophthalic acid. The system... [Pg.59]

A fabrication and packaging process has been developed for the OSC sensor devices. The OSC material is vacuum deposited on oxide-coated silicon wafers to which gold electrodes are then added. The electrodes extend off the side of the OSC film area onto the bare oxide where a thin titanium layer is used to provide sufficient adhesion for wire bonding. The chips are mounted in ceramic DIP packages using a room temperature cure adhesive and then wire bonded to the chip lead frame. A picture of a typical chip is shown in Fig. 7.12. [Pg.225]

The effect of water immersion (57°C) on the torsional shear strength of Versamid 140 (O) and DETA ( ) room temperature cured adhesive joints. [Pg.124]

Haars, A., Kharazipour, A., Zanker, H., and Huttermann, A. 1989. Room-temperature curing adhesives based on lignin and phenoloxidases. ACS Symp.Ser. 385 126-134. [Pg.263]

The mechanism of reaction is an important determinant in the adhesive-selection process. For example, if the processing requirements dictate that only a room-temperamre-curing adhesive system can be used, then temperature resistance may be sacrificed. There are very few room-temperature-curing adhesives that exhibit good elevated-temperature resistance because of the lack of extensive cross-linking and the weaker nature of the polymers formed with room-temperaturecuring formulations. [Pg.343]

A recent example of a cationic-catalyzed room temperature cured adhesive involves the mixing of trialkoxyboroxine catalysts (27) with poly-... [Pg.142]


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See also in sourсe #XX -- [ Pg.103 ]




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Adhesive curing

Cured adhesives

Room temperature

Room temperature cure

Room-temperature-curing adhesive

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