Resist chemistry mechanism

Knowledge that silyl substituents may be incorporated into standard resist chemistry to effect etching resistance has prompted several workers to evaluate silylated novolacs as matrix resins for conventional positive-photoresist formulations. Typically, these resists operate via a dissolution inhibition mechanism whereby the matrix material is rendered insoluble in aqueous base through addition of a diazonaphthoquinone. Irradiation of the composite induces a Wolff rearrangement to yield an indenecarboxylic acid (Figure 4), which allows dissolution of the exposed areas in an aqueous-base developer (35). 

In addition to analysis and characterization of resist components, spectroscopic techniques can find use in investigation of imaging mechanisms and resist chemistries. 

Resist Chemistry. The basic chemistry of epoxy novolac based chemically amplified resists has been proposed in the past by Stewart et al. (9J. According to this the Bronsted acid generated either photochemically or through electron beam exposure from the onium salt induces acid catalysed polymerization of the epoxy functionality. This mechanism implies that the proton generated by the exposure is actually bound to the polymer. Since the lithography consequences of this mechanism are obvious we decided to seek possible experimental evidence for the proton binding in the resist film under conditions of lithographic interest. 

Another consequence of the fixed pores and the rigid structure (high DVB levels) is that macroporous resins have limited swelling. Thus a wide range of solvents commonly used in organic synthesis can be used in solid-phase macroporous resin assisted chemistry (even water), without modification of the reaction conditions as required for the use of gel-type resins. Moreover, the rigid structure makes these supports very resistant to mechanical agitation and easy to handle (macroporous resins do not stick like gel type resins). 

Dichromated Resists. The first compositions widely used as photoresists combine a photosensitive dichromate salt (usually ammonium dichromate) with a water-soluble polymer of biologic origin such as gelatin, egg albumin (proteins), or gum arabic (a starch). Later, synthetic polymers such as poly(vinyl alcohol) also were used (11,12). Irradiation with uv light (X in the range of 360—380 nm using, for example, a carbon arc lamp) leads to photoinitiated oxidation of the polymer and reduction of dichromate to Ct(III). The photoinduced chemistry renders exposed areas insoluble in aqueous developing solutions. The photochemical mechanism of dichromate sensitization of PVA (summarized in Fig. 3) has been studied in detail (13). 

Positive-Tone Photoresists based on Dissolution Inhibition by Diazonaphthoquinones. The intrinsic limitations of bis-azide—cycHzed mbber resist systems led the semiconductor industry to shift to a class of imaging materials based on diazonaphthoquinone (DNQ) photosensitizers. Both the chemistry and the imaging mechanism of these resists (Fig. 10) differ in fundamental ways from those described thus far (23). The DNQ acts as a dissolution inhibitor for the matrix resin, a low molecular weight condensation product of formaldehyde and cresol isomers known as novolac (24). The phenoHc stmcture renders the novolac polymer weakly acidic, and readily soluble in aqueous alkaline solutions. In admixture with an appropriate DNQ the polymer s dissolution rate is sharply decreased. Photolysis causes the DNQ to undergo a multistep reaction sequence, ultimately forming a base-soluble carboxyHc acid which does not inhibit film dissolution. Immersion of a pattemwise-exposed film of the resist in an aqueous solution of hydroxide ion leads to rapid dissolution of the exposed areas and only very slow dissolution of unexposed regions. In contrast with crosslinking resists, the film solubiHty is controUed by chemical and polarity differences rather than molecular size. 

Polyimides (PI) were among the eadiest candidates in the field of thermally stable polymers. In addition to high temperature property retention, these materials also exhibit chemical resistance and relative ease of synthesis and use. This has led to numerous innovations in the chemistry of synthesis and cure mechanisms, stmcture variations, and ultimately products and appHcations. Polyimides (qv) are available as films, fibers, enamels or varnishes, adhesives, matrix resins for composites, and mol ding powders. They are used in numerous commercial and military aircraft as stmctural composites, eg, over a ton of polyimide film is presently used on the NASA shuttle orbiter. Work continues on these materials, including the more recent electronic apphcations. 

Clavulanic acid has only weak antibacterial activity, but is a potent irreversible inhibitor for many clinically important P-lactamases (10—14,57,58) including penases, and Richmond-Sykes types 11, 111, IV, V, VI ([Bacteroides). Type I Cephases are poorly inhibited. Clavulanic acid synergizes the activity of many penicillins and cephalosporins against resistant strains. The chemistry (59—63), microbiology (64,65), stmcture activity relationships (10,13,60—62,66), biosynthesis (67—69), and mechanism of action (6,26,27,67) have been reviewed. 

The synthesis of new polymeric materials having complex properties has recently become of great practical importance to polymer chemistry and technology. The synthesis of new materials can be prepared by either their monomers or modification of used polymers in industry. Today, polystyrene (PS), which is widely used in industrial applications as polyolefins and polyvinylchlorides, is also used for the production of plastic materials, which are used instead of metals in technology. For this reason, it is important to synthesize different PS plastic materials. Among the modification of PS, two methods can be considered, viz. physical and chemical modifications. These methods are extensively used to increase physico-mechanical properties, such as resistance to strike, air, or temperature for the synthesizing of new PS plastic materials. 

These standards also outline requirements for surface finish, grain size, heat treatment, metallurgical cleanness, absence of delta ferrite and alloy segregation to ensure that besides having a well balanced chemistry the alloys shall be in the proper metallurgical condition to yield optimum mechanical and corrosion resistant properties. 

Sjut, V. (Ed.) (1997). Molecular mechanisms of resistance to agrochemicals. In Chemistry of Plant Protection 13, Springer Berlin. 

One promising extension of this approach Is surface modification by additives and their Influence on reaction kinetics. Catalyst activity and stability under process conditions can be dramatically affected by Impurities In the feed streams ( ). Impurities (promoters) are often added to the feed Intentionally In order to selectively enhance a particular reaction channel (.9) as well as to Increase the catalyst s resistance to poisons. The selectivity and/or poison tolerance of a catalyst can often times be Improved by alloying with other metals (8,10). Although the effects of Impurities or of alloying are well recognized In catalyst formulation and utilization, little Is known about the fundamental mechanisms by which these surface modifications alter catalytic chemistry. 

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