Processing methods electrochemical liquid deposition

Beyond PVD and CVD, there are techniques from the liquid/solution phase such as sol-gel, spray coating, spin coating, electrochemical deposition and liquid phase epitaxy. The sol-gel process is the most widely used method for the deposition of metal oxide for gas sensors. 

A completely different approach might be the use of radio frequency plasma instead of a DC plasma. The ignition and sustainment of the plasma is decoupled from the application of voltages to the electrodes that are now used only for electrochemical reactions. Another method which has been proven to be quite successful is the application of an U-shaped tube in order to avoid an IR-drop over the ionic liquid (see Figure 10.2). Unfortunately, this set-up led to a large size distribution of the obtained particles but it showed that RF plasma could further improve the stability of the ionic liquids during the metal deposition process. 

Most film and particle formation techniques can be divided into gas-phase and liquid-phase deposition processes, which are briefly discussed in this section. Deposition of metal and metal oxides from metal enolate sources results from application of CVD, ALD, spin-coating, electrochemical and sol-gel methods, which are discussed in detail... 

On the other hand, liquid phase deposition (LPD) has been demonstrated as a flexible wet chemical method for preparing metal oxide nanostructured films on electrode surfaces. By the LPD process, electroactive titanium dioxide (Ti02) films were prepared on graphite, glassy carbon and ITO. The electrochemical properties of such LPD Ti02 films were dependent upon the film thickness controlled by the deposition time. The LPD technique was easily combined with other techniques, e.g., seed-mediated growth, which could provide metal/metal oxide composite nanomaterials. Moreover, hybrid nanostructured films were facilely obtained by doping dyes, surfactants and other... 

Introduction of filling materials into pores or the deposition on the PS surface is the result of the interaction between the PS and the different technological environments (ion beams, gaseous or liquid). The most frequently used techniques are electrochemical or chemical treatment. Their main advantages are the possibility to deposit materials inside pores, the simplicity of the equipment and the low cost of the process [2]. Other methods such as ion implantation, CVD techniques. 

---