Pretreatment methods smooth surfaces

However, the attainment of good adhesion between smooth surfaces exposes the mechanical interlocking theory as not being of wide applicability. For example, the elegant work of Tabor et al. [1,2] who studied the adhesion between two perfectly smooth mica surfaces and Johnson et aL [3] who examined the adhesion to optically smooth rubber surfaces, clearly demonstrates that adhesion may be attained with smooth surfaces. Also, detailed examination of surfaces roughened by typical industrial pretreatment methods, for example, grit-blasted metallic substrates (Fig. 3.1), usually reveals little... 

In another set of experiments, PBTMSS samples were etched in the reactor which has been configured for sputtering, i.e., with a relatively high RF power (0.8 W/cm ) coupled to the upper target electrode. The wafer potential in this mode is low (80 to 130 V). The resist thickness was reduced by about 800 to 1000 A after 1 min. of such treatment (Figure 1, curve D). However, the surface of the polymer was smooth and defect-free. It was also found that a PBTMSS film pretreated by this method would withstand subsequent standard O2 RIE pattern transfer in a manner similar to the sample pretreated by the high-bias process, i.e., without the formation of surface defects. For convenience this pretreatment process will be referred to as "sputter-mode etching" (SME). 

Once it has left the reactor, the wire may be either collected directly on the take-up via the drive assembly or returned to the resin tank for application of another layer of insulation via the pulley in Figure 3. Three layers of insulation are usually applied to the wire before take-up. Typical formulations for the experiments contain about 1% of a processing aid—e.g.y Nuosperse 657 (Nuodex Products Co.). Without the processing aid, the formulations wet copper poorly and bead on the wire. The processing aid is used to smooth the resin and furnish a uniform thickness of insulation. Surface contaminants on the conductor affect the continuity of the insulation. A forced, hot-air furnace serves as a simple method of pretreatment. The resin polymerizes in the photo-... 

The rate of diamond nucleation on untreated, smooth substrates is routinely low. Therefore, substrate pretreatment is a prerequisite for diamond deposition. A common method of pretreating substrates is to seed the surface by either mechanically polishing with a small diameter diamond powder (0.01-1 pm diameter) or ultrasonicating the substrate in a diamond powder/solvent slurry. For example, the diamond powder can be... 

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