Polymer interlayer protecting

Ea, above and below Tg. Three case studies illustrate the range of applicability of the bending beam setup and factors contributing to the stress state. The first is a comparison of two polymers for interlayer dielectrics PMDA-ODA (pyromellitic acid dianhydride - oxydiamine) and a bis-benzocyclobutene. The second is of a neat epoxy resin commonly used for microelectronics encapsulation (epoxidized ortho-cresol novolac cured with a phenolic novolac). The third is a screen-printable polyimide coating used for protection of the integrated-circuit chip. An outline of our stress model is sketched, and example results are presented. 

Three case studies are examined which illustrate the use of the bending beam stress experiment. The first is a comparison of two polymers for interlayer dielectrics. The second is of a neat epoxy resin commonly used for microelectronics encapsulation. The third is a polyimide coating used for protection of an integrated-circuit chip. 

The adherence of the ECP to the metal, in particular when dedoping has occurred, is also extremely important, and critical for good protection, but, unfortunately, is not always specified. A thin passive interlayer firmly anchored to the metal and to the polymer, generally resulting from a precipitation reaction between the metal ion and the doping anion, may improve the adhesion of the material. Of course, this implies a suitable choice of the electrolyte, which will depend both on the monomer and on the metal. Thus, in the following, a distinction will be made between ferrous and nonferrous metals, but also between the most usual conducting polymers (PPy, PANI, PT, and derivatives). 

Wang, X., Fan, J., 2014. Use of aluminum-coated interlayers to develop a cold-protective fibrous assembly. J. Appl. Polym. Sci. 131 (9), 40205... 

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