Polyimides photodefinable

Polyimides, both photodefinable and nonphotodefinable, are coming iato iacreased use. AppHcatioas iaclude planarizing iatedayer dielectrics oa iategrated circuits and for interconnects, passivation layers, thermal and mechanical stress buffers ia packagiag, alpha particle barriers oa memory devices, and ion implantation (qv) and dry etching masks. 

Reports of new materials and formulations and resin properties are prolific. Articles of a topical or applied interest include probes for in-situ hardness measurements on adhesives, photobase generators for image recording devices, oxygen inhibition in packaging applications, resins for sign boards, potentiometric sensors, new photodefinable polyimides, visible curable resists, " clay composites, putties, silica fillers, curable paints, soluble photocurable systems, fluorinated coatings and in-... 

Although, AIN fares well in terms of thermal conductivity, its dielectric permittivity is rather high. As polymeric materials such as polyimide possess e-values as low as 2.5, and are photodefinable, AlN/polyimide substrates with high thermal conductivity and low dielectric permittivity for combined thermal and signal delay management are now available. 

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