Polyimide polymerization

The differing behavior can be explained on the basis of their respective chemistries and their initial physical states. The polyimide polymerization occurs via a two step mechanism (Figure 4). First, the PMDA reacts with the ODA to yield a polyamic acid polymer. The polyimide is then formed by a ring closure reaction and yields water as a condensation by-product. Both reactions take place fairly rapidly at the temperatures at which the PMDA-ODA is manufactured. 

This polymerization is carried out in the two stages indicated above precisely because of the insolubility and infusibility of the final product. The first-stage polyamide, structure [IX], is prepared in polar solvents and at relatively low temperatures, say, 70°C or less. The intermediate is then introduced to the intended application-for example, a coating or lamination-then the second-stage cyclization is carried out at temperatures in the range 150-300°C. Note the formation of five-membered rings in the formation of the polyimide, structure [X], and also that the proportion of acid to amine groups is 2 1 for reaction (5.II). 

Moleculady mixed composites of montmorillonite clay and polyimide which have a higher resistance to gas permeation and a lower coefficient of thermal expansion than ordinary polyimides have been produced (60). These polyimide hybrids were synthesized using montmorillonite intercalated with the ammonium salt of dodecylamine. When polymerized in the presence of dimethyl acetamide and polyamic acid, the resulting dispersion was cast onto glass plates and cured. The cured films were as transparent as polyimide. 

Polymerization by Transimidization Reaction. Exchange polymerization via equihbrium reactions is commonly practiced for the preparation of polyesters and polycarbonates. The two-step transimidization polymerization of polyimides was described in an early patent (65). The reaction of pyromellitic diimide with diamines in dipolar solvents resulted in poly(amic amide)s that were thermally converted to the polyimides. High molecular weight polyimides were obtained by employing a more reactive bisimide system (66). The intermediate poly(amic ethylcarboamide) was converted to the polyimide at 240°C. 

Polymerization by G—G Goupling. An aromatic carbon—carbon coupling reaction has been employed for the synthesis of rigid rod-like polyimides from imide-containing dibromo compounds and aromatic diboronic acids ia the presence of palladium catalyst, Pd[P(CgH )2]4 (79,80). 

A continuing trend has been to polymeric retainers. Laminated phenoHc cages have often been used for high speeds at temperatures up to 130°C. Heat stabili2ed nylon-6,6 has come iato broad use ia small ball beariags, both with and without glass reinforcement (39). Polyimide and PTFE are used up to 250°C. 

A number of polymeric coatings, primarily polyimides, epoxies, and sHicones, are used as adhesives and ia other aspects of packagiag, as well as for final eacapsulatioa and protection of the iategrated circuit. 

Kapton resin (5) (113) and Upilex (6) resin (114) are sold as films, partially polymerized resin coating solutions, and sinterable powders. Allied Signal also offers Apical polyimide film. 

Additive Polyimides. Rhc ne-Poulenc s Kin el molding compound and Kerimid impregnating resin (115), Mitsubishi s BT Resins (116), and Toshiba s Imidaloy Resin (117) are based on bismaleimide (4) technology. Maleic anhydride reacts with a diamine to produce a diimide oligomer (7). Eurther reaction with additional diamine (Michael addition) yields polyaminohismaleimide prepolymer with terminal maleic anhydride double bonds. Cure is achieved by free-radical polymerization through the terminal double bonds. 

While polymeric surfaces with relatively high surface energies (e.g. polyimides, ABS, polycarbonate, polyamides) can be adhered to readily without surface treatment, low surface energy polymers such as olefins, silicones, and fluoropolymers require surface treatments to increase the surface energy. Various oxidation techniques (such as flame, corona, plasma treatment, or chromic acid etching) allow strong bonds to be obtained to such polymers. 

Bis-maleimide resins composed of BMI and diamines have been reported in the early 1960s in the patent literature. Since that time, a number of patents have appeared describing improvements in their properties and uses [3]. Although many bis-maleimide resins are commercially developed, relatively few reports of their use as adhesives are to be found in scientific journals [4-10]. Improvements of maleimide resins are mirrored in the improvements of thermosetting polyimides. For example, the method of in situ polymerization of monomer reactants (PMR method) was developed [6]. 

The synthesis of polyimides with the pending group (aliphatic or fluorinated substituent) and some relationships between the polymeric structure and the value of the tilt angle have been reported.35... 

Basically, the first approach to correlate the polyimide chain organization to the monomer structure was to take into consideration the electron affinity of the anhydride and the ionization potential of the diamine,10 as shown in Fig. 5.3. The strongest interactions between the polymeric chain are expected when the polyimide is prepared with the dianhydride having the highest electron affinity and die diamine with the lowest ionization potential. The strongest interchain interaction leads to high Tg and low solubility. 

The sizes and concentration of the free-volume cells in a polyimide film can be measured by PALS. The positrons injected into polymeric material combine with electrons to form positroniums. The lifetime (nanoseconds) of the trapped positronium in the film is related to the free-volume radius (few angstroms) and the free-volume fraction in the polyimide can be calculated.136 This technique allows a calculation of the dielectric constant in good agreement with the experimental value.137 An interesting correlation was found between the lifetime of the positronium and the diffusion coefficient of gas in polyimide.138,139 High permeabilities are associated with high intensities and long lifetime for positron annihilation. 

The first patent of Edwards and Robinson147 claims the condensations of pyromel-litic acid and aliphatic diamine salt to prepare polyimide. Recently, that approach has been revisited, and biphenyl tetracarboxylic and pyromellitic acids give a salt monomer by reaction with 1 mol of an aliphatic diamine (octamethylene diamine and dodecamethylene diamine). The salts were polymerized under 250 MPa at 250°C for 5 h in closed reaction vessels (Fig. 5.32) giving crystalline polymers.148 By reaction of pyromellitic tetraacid with oxydianiline, it has been possible to isolate a monomeric salt. It was polymerized under 30 MPa giving a PMDA-ODA polyimide with water elimination. 

Two-shot techniques for acyclic diene metathesis, 435-445 for polyamides, 149-164 for polyimides, 287-300 for polyurethanes, 241-246 for transition metal coupling, 483-490 Anionic deactivation, 360 Anionic polymerization, 149, 174 of lactam, 177-178 Apolar solvents, 90 Aprotic polar solvents, 185, 338 Aprotic solvents, low-temperature condensation in, 302 Aqueous coating formulations, 235 Aqueous polyoxymethylene glycol, depolymerization of, 377 Aqueous systems, 206 Ardel, 20, 22... 

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