Polyimide interlevel dielectric/passivant

The present work is a report of the properties of polyimide which define functionality as an interlevel dielectric/passivant. Thus, the planarizing and patterning characteristics and electrical characteristics of current vs voltage, dissipation, breakdown field strength, dielectric constant, charge and crossover isolation are discussed in addition to the reliability-related passivation properties. 

In the case of a photoresist, the ultimate definable feature size together with the ability of the material to withstand either chemical etchants or plasma environments determines the domain of utility. The feature size is in turn determined by the wavelength required for exposure, the sensitivity and contrast of the resist, and the dimensional stability of the material during exposure, development, and subsequent processing. Adhesion of the resist to the substrate is critical both for patterning and use, and adhesion can be affected by surface preparations, and by residual stresses developed during deposition and cure. While photo-imagable polyimides have been introduced, their principal intended application is as a component of the finished part, either as passivant or interlevel dielectric (see below). 

In order for a polyimide to be useful as an interlevel dielectric or protective overcoat (passivant), additional demanding property requirements must be met In the case of the passivant, the material must be an excellent electrical insulator, must adhere well to the substrate, and must provide a barrier for transport of chemical species that could attack the underlying device. It has been demonstrated that polyimide filrns can be excellent bulk barriers to contaminant ion motion (such as sodium) [10], but polyimides do absorb moisture [11,12], and if the absorbed moisture affects adhesion to the substrate, then reliability problems can result at sites where adhesion fails. However, in the absence of adhesion failure, the bulk electrical resistance of the polyimide at ordinary device operating temperatures and voltages appears to be high enough to prevent electrochemical corrosion [13]. 

Aromatic polyimides have found extensive use in electronic packaging due to their high thermal stability, low dielectric constant, and high electrical resistivity. Polyimides have been used as passivation coatings, (1) interlayer dielectrics, (2) die attach adhesives, (3) flexible circuitry substrates, (4) and more recently as the interlevel dielectric in high speed IC interconnections. (5) High speed applications require materials with a combination of low dielectric constant, flat dielectric response versus frequency and low water absorption. 

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