Polyimide-amide

Rhodeftal. [Rhone-Poulenc Plastiques Tedi.] Polyimides-amides. 

The polyimides are mechanically stable in air up to about 350 C and do not significantly distort at even higher application temperatures. But they are difficult to produce and to work. Polyimide amides and polyester imides do not have these disadvantages, but because of this, also have less advantageous thermal stabilities. They are produced by directly converting diamines with trimellitic anhydride or by reaction of diamines with a precursor from trimellitic anhydride and phenolic esters, e.g.. 

PI A, polyimide amide PET, poly(ethylene terephthalate) PHB, poly(p-hydroxybenzoic acid) PI, polyimide PS, poly(styrene) LDPE, low-density poly(ethylene) GF, glass fiber. 

The work deals with Ag-migration between tinned Ag-Pd iands (free Ag along edges) in an encapsulated vehicle consisting of a polyimide-amide surface coating, aiuminum cap and silicone rubber or epoxy backseal. Figure 1 shows the test site. 

Since 1975, numerous polyimide backbones containing hexafluoroacetone or Ihexafluoroisopropoxybenzene groups have been investigated (43,44). These polymers show greatly enhanced solubiHty (up to 20% in amide solvents) and significant promise in gas separation research and technology. 

Carboxyhc acids react with aryl isocyanates, at elevated temperatures to yield anhydrides. The anhydrides subsequently evolve carbon dioxide to yield amines at elevated temperatures (70—72). The aromatic amines are further converted into amides by reaction with excess anhydride. Ortho diacids, such as phthahc acid [88-99-3J, react with aryl isocyanates to yield the corresponding A/-aryl phthalimides (73). Reactions with carboxyhc acids are irreversible and commercially used to prepare polyamides and polyimides, two classes of high performance polymers for high temperature appHcations where chemical resistance is important. Base catalysis is recommended to reduce the formation of substituted urea by-products (74). 

Polymerization by Transimidization Reaction. Exchange polymerization via equihbrium reactions is commonly practiced for the preparation of polyesters and polycarbonates. The two-step transimidization polymerization of polyimides was described in an early patent (65). The reaction of pyromellitic diimide with diamines in dipolar solvents resulted in poly(amic amide)s that were thermally converted to the polyimides. High molecular weight polyimides were obtained by employing a more reactive bisimide system (66). The intermediate poly(amic ethylcarboamide) was converted to the polyimide at 240°C. 

In addition they may contain ether, amide, carbonyl, sulfone, or other functional groups. References 28 and 29 provide excellent reviews of polyimide chemistry. 

American Society for Testing and Materials (ASTM), 242 Amic acid ammonium salt, polyimide cyclization via, 305 Amic acid formation, 301 Amidation reaction scheme, 151 Amide-amide interchange reaction, 158 Amide concentration, in polyamides, 139-141... 

Fig. 21.18. Synthesis of a polyimide from an aromatic dianhydride (DAN) and an aromatic diaminoether (DA). The DA is synthesized by the second (lower) two-step reaction. All reactions were performed in the solvent, demethylacet-amide (DMAC).

Cobalt(II) chloride was dissolved in poly(amide acid)/ N,N-dimethylacetamide solutions. Solvent cast films were prepared and subsequently dried and cured in static air, forced air or inert gas ovens with controlled humidity. The resulting structures contain a near surface gradient of cobalt oxide and also residual cobalt(II) chloride dispersed throughout the bul)c of the film. Two properties of these films, surface resistivity and bullc thermal stability, are substantially reduced compared with the nonmodified condensation polyimide films. In an attempt to recover the high thermal stability characteristic of polyimide films but retain the decreased surface resistivity solvent extraction of the thermally imidized films has been pursued. 

Polymer Synthesis and Modification. The condensation reaction between either BTDA or BDSDA and ODA was performed in DMAc at room temperature under a nitrogen atmosphere. ODA (0.004 mole) was added to a nitrogen-purged glass septum bottle with 7 ml DMAc. One of the dianhydrides (0.004 mole) was then added to the diamine solution with an additional milliliter of DMAc resulting in 15-25 wt% solids depending upon the monomer combination. The resulting solution was stirred for 20-24 hours to form the poly(amide acid), a polyimide precursor. For the modified polyimides, anhydrous cobalt(II) chloride (0.001 mole) was added as a solid within one-half hour after the dianhydride. 

The polyimide is formed by the thermal polycyclocondensation of the poly(amide acid). For this purpose, 5 ml of poly(amide acid) solution are placed on a watch glass (diameter 10 cm) and kept in a vacuum oven at 50 °C for 24 h.The solvent evaporates and at the same time cyclization to the polyimide takes place the resulting film is insoluble in dimethylformamide.The formation of the polyimide can be followed by IR spectroscopy the NH-band at 3250 cm disappears while imide bands appear at 1775 and 720 cm" Once the initial drying process has raised the solid content to 65-75%, the polyimide formation can be accelerated by heating the poly(amide acid) film to 300 °C in a vacuum oven for about 45 min.The polyimide made from pyromellitic dianhydride and 4,4 -oxydianiline exhibits long-term stability in air above 200 °C. 

Poly(amic acids) in which the ortho-carboxylic group has been chemically modified to either an ester- or amide moiety have been known for many years. However, their commercial significance was non-existent until very recent applications involving dielectric insulators [48] and photosensitive polyimide precursors [49, 50]. As with many synthetic pathways, there are generally several ways to arrive at the same goal. Similarly, the preparation of derivatized poly(amic acids) can be divided into two general categories ... 

The preparation of N-alkyl imides by exchange reaction of an imide with an alkyl amine was documented [104] well before the application of this chemistry to the preparation of polyimides [105], see Scheme 30. Although no experimental details are provided, the initial reaction of pyromellitimide with p,p-methylene dianiline in NMP takes place at reflux temperatures to apparently yield a poly(amic amide). Subsequent heating of this intermediate at elevated temperatures ( 300 °C) provides the desired polyimide with evolution of ammonia. The final polyimide is quoted to be thermally and chemically stable, however, no mechanical properties are given. 

Thus, N-pyrimidine phthalimide reacted with hexylamine at room temperature to form an amide-amide. The initial amide-amide formation proceeded more rapidly in chloroform as compared to dimethylsulfoxide (DM SO). However, the ring closure reaction to the imide was favored by the more polar, aprotic DMSO solvent, yielding the imide in nearly quantitative yield after 3 hours at 75 °C. The authors were able to utilize this synthetic approach to prepare well-defined segmented poly(imide-siloxane) block copolymers. It appears that transimidi-zation reactions are a viable approach to preparing polyimides, given that the final polyimide has a Tg sufficiently low to allow extended excursions above the Tg to facilitate reaction without thermal decomposition. Additionally, soluble polyimides can be readily prepared by this approach. Ultimately, high Tg, insoluble polyimides are still only accessable via traditional soluble precursor routes. 

The idea of synthesizing imide oligomers which carry acetylenic terminations appeared attractive because homopolymerization through acetylenic endgroups occurs without any volatile evolution and provides materials with good properties. Landis et. al (8,9) published the synthesis of such acetylene terminated imide oligomers from benzophenone tetracarboxylic anhydride, aromatic diamine and 3-ethynylaniline via the classical route. As usual, the amide acid is formed as an intermediate which, after chemical cyclodehydration, provides the polymide. Since ethynyl-terminated polyimide is used as a matrix resin for fiber composites, processing is possible via the amide acid, which is soluble in acetone, or via the fully imidized prepolymer, which is soluble in NMP. The chemical structure of the fully imidized ethynyl-terminated polyimide is provided in Fig. 44. 

The key to acetylene terminated polyimides is the availability of the end-capper which carries the acetylene group. Hergenrother (130) published a series of ATI resins based on 4-ethynylphthalic anhydride as endcapping agent. This approach first requires the synthesis of an amine-terminated amide acid prepolymer, by reacting 1 mole of tetracarboxylic dianhydride with 2 moles of diamine, which subsequently is endcapped with 4-ethynylphthalic anhydride. The imide oligomer is finally obtained via chemical cyclodehydration. The properties of the ATI resin prepared via this route are not too different from those prepared from 3-ethynylaniline as an endcapper. When l,3-bis(3-aminophenox)benzene was used as diamine, the prepolymer is completely soluble in DMAc or NMP at room temperature, whereas 4,4 -methylene dianiline and 4,4 -oxydianiline based ATIs were only partially soluble. The chemical structure of ATIs based on 4-ethynylphthalic anhydride endcapper is shown in Fig. 45. 

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