Poly etching methods

Several different analytical and ultra-micropreparative CEC approaches have been described for such peptide separations. For example, open tubular (OT-CEC) methods have been used 290-294 with etched fused silicas to increase the surface area with diols or octadecyl chains then bonded to the surface.1 With such OT-CEC systems, the peptide-ligand interactions of, for example, angiotensin I-III increased with increasing hydrophobicity of the bonded phase on the capillary wall. Porous layer open tubular (PLOT) capillaries coated with anionic polymers 295 or poly(aspartic acid) 296 have also been employed 297 to separate basic peptides on the inner wall of fused silica capillaries of 20 pm i.d. When the same eluent conditions were employed, superior performance was observed for these PLOT capillaries compared to the corresponding capillary zone electrophoresis (HP-CZE) separation. Peptide mixtures can be analyzed 298-300 with OT-CEC systems based on octyl-bonded fused silica capillaries that have been coated with (3-aminopropyl)trimethoxysilane (APS), as well as with pressurized CEC (pCEC) packed with particles of similar surface chemistry, to decrease the electrostatic interactions between the solute and the surface, coupled to a mass spectrometer (MS). In the pressurized flow version of electrochromatography, a pLC pump is also employed (Figure 26) to facilitate liquid flow, reduce bubble formation, and to fine-tune the selectivity of the separation of the peptide mixture. 

In this paper, optimum design method for poly(chloromethylstyrene-co-2-vinylnaphthalene) is presented, based on theoretical analysis for copolymer sensitivity and on the dry etch rate dependence on polymer structure obtained by a series of experiments. 2-vinylnaphthalene was selected as a main constituent of the polymer, as poly(2-vinylnaphthalene) was found to be a negative resist with high contrast and high dry etch resistance ( 4 ). 

A third way to build up pFCs based on MEMS-polymers such as poly-dimethylsiloxane (PDMS) or polymethyl methacrylate (PMMA) or PCB-materials such as polyimid (PI) or FR4. These polymers can be micro-machined by molding or by laser ablation. Shah et al. [22,23] have developed a complete PEMFC system consisting of a PDMS substrate with micro-flow channels upon which the MEA was vertically stacked. PDMS micro-reactors were fabricated by employing micro-molding with a dry etched silicon master. The PDMS spin coated on micro-machined Si was then cured and peeled off from the master. The MEA employed consisted in a Nafion - 12 membrane where they have sputtered Pt through a Mylar mask. Despite an interesting method, this FC gave poor results, a power density of 0.8 mW cm was achieved. 

There are a variety of materials that can be used as sacrificial cores. Inorganic sacrificial materials include Si02 and metals such as aluminum, " titanium, and nickel. Polymers such as PI, PMMA, PC, and photoresist have also been used as sacrificial materials. After deposition of the cover film, removal of the sacrificial layer can be achieved by dissolution, etching, or thermal degradation. These removal methods each have benefits and drawbacks selection of the optimal approach is specific to particular combinations of substrate, sacrificial layer, and cover film 73, 3 Recently Whitesides and coworkers " implemented a fabrication method using water-soluble sacrificial cores. Poly(acrylic acid) and dextran proved to be effective sacrificial layers that could be dissolved in water or aqueous NaCl, for making metallic microstructures by nickel electrodeposition. 

A positive type photosensitive PI resin composition can be made up from a solvent-soluble PI, a poly(amic acid) compound, and by an o-quinonediaz-ide compound.The latter compound releases acid groups when irradiated by UV light. The method of etching is based on the principle that although the PI resin itself is not photosensitive, the photosensitive substance becomes alkali-soluble upon exposure and it is dissolved in an alkali together with the PI resin. ... 

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