Platen temperatures

Press control is critical it is essential that the elastomeric compound reaches the required cure state to optimize product performance yet remains in the press the shortest time period to maximize productivity. To meet this objective, both compression and injection presses now use microprocessor controls, which enable variations in platen temperatures and compound cure characteristics to be accommodated without sacrificing product performance or productivity. 

It is clear from the results obtained that the core temperature rises above the platen temperature in the presence of phthalic anhydride. Since no unusual differences in the DSC thermogram of whey-based resin in the presence and in the absence of phthalic anhydride were seen, the exothermic phenomenon being observed under conditions of board preparation deserves further investigation. 

Procedure. Specimen Fabrication. The reinforcements were mixed into the polystyrene melt on a Farrell two-roll mill at 320°F. It was necessary to dry the asbestos fibers for 24 hr at 250°F prior to mixing to ensure the breakup of bundle aggregates. The milling/fluxing time was held to 8 min for all samples. The sheets obtained in milling were cut, crossplied, and compression molded in an open frame on a Wabash press. After they reached the platen temperature the material was held at 330 °F and 2000 psi for 6 min. The frame was then transferred to a cold press, and the sample was cooled under the same pressure. The test specimens were cut from ys-inch thick plates prepared in the foregoing manner. 

As W CMP is a combination of chemical and mechanical actions, the temperature between the pad and the wafer will rise during polishing because of mechanical friction and chemical reactions. Without a precise control of platen temperature, the removal rate from wafer to wafer will not be consistent. For example, as shown in Fig. 9.12, the removal rates increase significantly and then reach a relative plateau for a typical slurry using a platen that is not temperature controlled. 

What is the best regulation point for W CMP platen temperature Explain why. 

Copper Removal Rate (Integrated) and Platen Temperature as a Function of Polish Time... 

All milled specimens were cured for 25 minutes in standard 6 X 6 X 0.075 inch ASTM molds, using a pressure of 4000 pounds per square inch and a platen temperature of approximately 150° C. 

The panel needs to be in the press long enough for the heat from the platens to reach the centreline of the panel and cure the resin, forming bonds of sufficient strength to allow the panel to be handled as it leaves the press. This depends not only on the platen temperature (or that of the steel transport bands in the case of a continuous press), but also on the rate of heat transfer through the mat. This is influenced by a number of factors such as the density of the panel and the resin type, and most significantly on the moisture content of the material in the press. 

Aluminum panels, which had a thickness of 0.61 and 1.63 mm, were etched with chromic acid. ASTM procedure D3167—76 (reapproved 1981) was followed for 135° peel tests. The adhesive film was placed between the aluminum panels and press-laminated at a temperature of 177 °C for 1 h at a pressure of approximately 5 psi (34.5 x 103 Pa). The temperature was then increased to 220 °C, and the joints were kept under pressure for another hour. The heaters in the hydraulic press were then switched off and the platens air-cooled and then water-cooled until the platen temperature was down to 100 °C. The bonded panels were cut into 12.7-mm-wide joints and tested at a rate of 20 mm/min and at a peel angle of 135°. 

Rough panel thickness (mm) Number of plies Panels per press opening Platen temperature (°C) Pressing time at full pressure (min)... 

Fig. 5 Gas chromatograms of blank (a) and spiked (b) human urine samples containing 1-bromopropane, 2-bromopropane, and 1-bromobutane as the internal standard. Static headspace sampling was used with the following conditions Tekmar model 7000 HT headspace sampler with a 1.0 ml sample loop and platen temperature of 75 C and a valve/loop temperature of 120 C. Sample equilibrium time was 34 min. The Agilent Technologies Model 6890 gas chromatograph was equipped with an Agilent J W DB-1 (dimethylpolysHoxane) column with a 1 p,m film thickness. Initial column temperature was 45 C with a 10 min hold, then increased at a rate of 12.5°C/min to a final temperature of 170°C. A microelectron capture detector (p,-ECD) was used.

The conduction heating process has been used almost exclusively for ceramic substrate because these materials do not degrade when exposed to the high platen temperatures. Thermal degradation would be more likely for organic laminates. Best results are realized when this process is used with relatively thin substrates (<1.0 mm). 

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