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Plated-through holes, printed wiring

Plated through hole multilayer circuit boards, MIL P 55640. Also see Printed wiring for elec tronic equipment, MIL STD 1495. [Pg.144]

Freedman, G. M., Patel, K. B., Batchelder, R. G., Method and Process for Soldering Reflow-Compatible Plated Through-Hole Components into Printed Wiring Board in Order to Circumvent the Wave Soldering Process (Biuied Intrusive Reflow Soldering and Rework), Research Disclosure, May 2006, pp. 543-545. [Pg.1133]

K. Kurosawa, Y. Takeda, K. Takagi, and H. Kawamata, Investigation of Reliability Behavior of Plated-Through-Hole Multilayer Printed Wiring Boards, IPC-TP-385, IPC, Evanston, 111., 1981. [Pg.1361]

IPC-TR-579, Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards, Institute of Interconnecting and Packaging Electronic Circuits, Lincoln-wood, 111. The IPC recently initiated a second round robin study, the results of which should be available in about 1996. [Pg.1362]

PLATED-THROUGH HOLE A hole in which electrical connection is made between printed wiring board layers with conductive patterns by the deposition of metal on the wall of the hole.(See PTH.)... [Pg.1615]

It would not be unreasonable to include through-holes in printed wiring boards in the scope of feature-scale current distribution problems. In through-hole plating. [Pg.123]

Coefficient of thermal expansion Tee.—Surface-mount assembly process subjects the printed wiring assembly to more numerons temperature shocks than typical through-hole processes. At the same time, the increase in lead density has caused the designer to nse more and more layers, making the board more susceptible to problems concerned with the base material s coefficient of thermal expansion Tce- This can be a particular problem with regard to the z-axis expansion of the material, as this induces stresses in the copper-plated hole, and becomes a rehabihty concern. Figure 13.12 shows typical z-axis expansion for a variety of printed circuit base laminate materials. [Pg.297]

Conventional multilayer printed wiring boards must be subjected to drilling and through-hole plating to create interconnections. These holes represent inefficient use of PWB area. In addition, to connect the printed wiring with part connection lands, some through holes must be provided in areas other than where the lands are located. [Pg.502]

Through Hole Plating for Printed Wiring Boards... [Pg.184]

Printed wiring boards Through hole plating Chemical polymerization EDOT (microemulsion) Manganese dioxide (via KMn04 as etching agent) Established... [Pg.266]

See other pages where Plated-through holes, printed wiring is mentioned: [Pg.117]    [Pg.124]    [Pg.117]    [Pg.124]    [Pg.117]    [Pg.228]    [Pg.235]    [Pg.201]    [Pg.124]    [Pg.74]    [Pg.510]    [Pg.1030]    [Pg.312]    [Pg.314]    [Pg.146]    [Pg.102]    [Pg.495]    [Pg.84]    [Pg.111]    [Pg.228]    [Pg.444]    [Pg.400]    [Pg.412]    [Pg.550]    [Pg.438]    [Pg.185]    [Pg.268]    [Pg.1784]    [Pg.210]    [Pg.747]   


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Plated through-holes

Plating through hole

Print-through

Printed wiring

Printing plate

Through-hole

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