Plate influence

O Electrically charged plates influence droplet s motion... 

Y. Obata, N. Noda, Unsteady thermal stresses in a flmctionally gradient material plate(Influence of heating and cooling conditions on unsteady thermal stresses), Trans. JSME., Series A, 59, 1097-1103 H993). 

The variation of layer thickness along the plate influences the results. 

This paper deals with the control of weld depth penetration for cylinders in gold-nickel alloy and tantalum. After introducing the experimental set-up and the samples description, the study and the optimization of the testing are presented for single-sided measurements either in a pulse-echo configuration or when the pump and the probe laser beams are shifted (influence of a thermal phenomenon), and for different kind of laser impact (a line or a circular spot). First, the ultrasonic system is used to detect and to size a flat bottom hole in an aluminium plate. Indeed, when the width of the hole is reduced, its shape is nearly similar to the one of a slot. Then, the optimization is accomplished for... 

Kalachev A A, Sauer T, Vogel V, Plate N A and Wegner G 1990 Influence of subphase conditions on the properties of Langmuir-Blodgett-films from substituted phthalocyaninato-polysiloxanes Thin Solid Films 188 341-53... 

Now t[i is a minimum when k = 2, that is, when = 3t . There is little increase in analysis time when k lies between 1 and 10. A twofold increase in the mobile-phase velocity roughly halves the analysis time (actually it is the ratio Wu which influences the analysis time). The ratio Wu can be obtained from the experimental plate height/velocity graph. 

The pores in question can represent only a small fraction of the pore system since the amount of enhanced adsorption is invariably small. Plausible models are solids composed of packed spheres, or of plate-like particles. In the former model, pendulate rings of liquid remain around points of contact of the spheres after evaporation of the majority of the condensate if the spheres are small enough this liquid will lie wholly within the range of the surface forces of the solid. In wedge-shaped pores, which are associated with plate-like particles, the residual liquid held in the apex of the wedge will also be under the influence of surface forces. 

Equations 12.21 and 12.22 contain terms corresponding to column efficiency, column selectivity, and capacity factor. These terms can be varied, more or less independently, to obtain the desired resolution and analysis time for a pair of solutes. The first term, which is a function of the number of theoretical plates or the height of a theoretical plate, accounts for the effect of column efficiency. The second term is a function of a and accounts for the influence of column selectivity. Finally, the third term in both equations is a function of b, and accounts for the effect of solute B s capacity factor. Manipulating these parameters to improve resolution is the subject of the remainder of this section. 

For plastic-bonded materials, no clear-cut expression for the coercivity is known. It may be expected that it is rather similar, but with a smaller influence of B. For loosely packed powders, the B influence has become zero and should be multiphed by 0.48 to account for the isotropy (71). In all cases high coercivity is obtained by using small grains with limited plate-like shape, ie, the value of Nis not too high. 

Aminophenol. This compound forms white plates when crystallized from water. The base is difficult to maintain in the free state and deteriorates rapidly under the influence of air to pink-purple oxidation products. The crystals exist in two forms. The a-form (from alcohol, water, or ethyl acetate) is the more stable and has an orthorhombic pyramidal stmcture containing four molecules per unit cell. It has a density of 1.290 g/cm (1.305 also quoted). The less stable P-form (from acetone) exists as acicular crystals that turn into the a-form on standing they are orthorhombic bipyramidal or pyramidal and have a hexamolecular unit (15,16,24) (see Tables 3—5). 

Copper etchants do not directly influence the electroless plating process, but are used merely to remove unwanted copper, and should not affect the deposit properties. The costs of waste treatment and disposal have led to disuse of throw-away systems such as chromic—sulfuric acid, ferric chloride, and ammonium persulfate. Newer types of regenerable etchants include cupric chloride, stabilized peroxide, and proprietary ammoniacal etchant baths. 

A problem that affects the accuracy of the prediction of plating thickness is in estimating the actual current density. Current is not evenly distributed over the surface of the part being plated, rather, it takes the path of least resistance. Current also concentrates on sharper points, corners, and edges even the shape of the plating tank can have an influence on the current distribution. The difference in current and, subsequendy, the plate thickness distribution, is minimal when geometrically conforming anodes are part of the system, but this condition is not often achieved. 

In the references cited previously, the authors discuss the influence of operating variables upon the performance of plate towers when large heat effects are involved. Some general observations are as follows ... 

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