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Phenol epoxide coatings

Uses Catalyst increasing crosslinking speed, adhesion promoter for heatcuring coating systems based on e.g., phenolic-epoxide resins improves sulfur staining resist, of interior can coatings Properties Lt. to dk. reddish low-vise, liq. dens. = 0.88 g/cm (20 C) ... [Pg.28]

Uses Phenolic for heat-curable phenolic/epoxide resin combinations, can coatings, chemically resist, protective coatings Properties Dilutable with MEK, MIBK, ethyl acetate, butyl acetate, methoxypropyl acetate, methoxypropanol dens. = 1.05 g/cm (20 C) dynamic vise. 180-300 mPa S flash pt. = 43 C 63-67% NV Storage 6 mos min. shelf life stored in original containers below 25 C Phenodur PR 260/68B [Solutia]... [Pg.622]

Chem. Descrip. Phenolic resin (55%) in isobutanol/butanol Uses Phenolic for internal/external coating of pkg. containers, can coatings, high-adhesion chemically resist, protective coatings for apparatus, vessels, pipelines, and for heat-curing phenolic/epoxide combinations Features Unplasticized... [Pg.622]

NB Daia for the three important ihermosetting materials (phenolics, aminoplastics and epoxide resins) were not covered in the 1998 review on which the 1997 data was based. The 1987 figures for these materials do include a substantial percentage of use in adhesive, surface coating and laminate applications. [Pg.12]

Tertiary amines such as benzyldimethylamine, 2-(dimethyl aminoethyl) phenol, etc. form an anion with epoxide which leads to their polymerisation. These are used mainly for adhesives and surface coating applications. [Pg.173]

Ea, above and below Tg. Three case studies illustrate the range of applicability of the bending beam setup and factors contributing to the stress state. The first is a comparison of two polymers for interlayer dielectrics PMDA-ODA (pyromellitic acid dianhydride - oxydiamine) and a bis-benzocyclobutene. The second is of a neat epoxy resin commonly used for microelectronics encapsulation (epoxidized ortho-cresol novolac cured with a phenolic novolac). The third is a screen-printable polyimide coating used for protection of the integrated-circuit chip. An outline of our stress model is sketched, and example results are presented. [Pg.351]

See other pages where Phenol epoxide coatings is mentioned: [Pg.381]    [Pg.768]    [Pg.775]    [Pg.951]    [Pg.64]    [Pg.507]    [Pg.88]    [Pg.160]    [Pg.77]    [Pg.125]    [Pg.740]    [Pg.88]    [Pg.32]    [Pg.775]    [Pg.360]    [Pg.944]    [Pg.949]    [Pg.47]    [Pg.52]    [Pg.56]    [Pg.60]    [Pg.62]    [Pg.129]    [Pg.137]    [Pg.142]    [Pg.247]    [Pg.295]    [Pg.314]    [Pg.350]    [Pg.351]    [Pg.355]    [Pg.375]    [Pg.378]    [Pg.388]    [Pg.401]    [Pg.412]    [Pg.416]    [Pg.435]    [Pg.452]    [Pg.457]    [Pg.487]    [Pg.488]    [Pg.541]   
See also in sourсe #XX -- [ Pg.383 ]



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Phenolics coatings

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