Multichip packaging package size

Multichip Packaging. A solution to these problems is to mount a number of ICs closely together on a common substrate within an MCP. The obvious advantages of the MCP are the reduction in the overall size and weight of the package and, thus, the reduction in the size and cost of the system. The reliability of the system is also improved, because the chip-to-chip interconnections can be accomplished within the package, which reduces the number of package-to-board connections. 

In assembling hybrid microcircuits or multichip modules, ceramic interconnect substrates fabricated using thin-film or thick-film processes are attached to the inside base of a ceramic or metal package. Generally, film adhesives that have been cut to size are used to attach large substrates (greater than 1-inch square) while either paste or film adhesives may be used for smaller substrates. Substrates may be alumina, beryllia, aluminum nitride, or silicon. 

This multichip module was designed for military airborne communications applications where small size, high density, and low weight were critical to system performance. The module shown in Figure 1.20 is a 25.4-mm (1-in.) square package with a multilayer thick-film substrate with 125-pm (5-mil)... 

This thick-film multichip module substrate (Figure 1.22) packaged the row and column driver circuits for an electroluminescent avionics flat panel cockpit display. The three-conductor-layer substrate is 86.4 x 111.8 mm (3.4 X 4.4 in.) in size with 43 metallized through vias in the alumina substrate for interconnections on both sides of the substrate. On the component side, the 14 row and column driver ICs are aluminum-wire-bonded with a total... 

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