Microcontact printing

Microcontact printing (pCP) is a technique that uses an elastomeric stamp with relief on its surface to generate patterned SAMs on the surface of both planar and curved substrates [87,88]. SAMs are highly ordered molecular assemblies that form spontaneously by chemisorption of functionalized long-chain molecules on the surfaces of appropriate substrates [79,89]. Well-established systems of SAMs include alkanethiolates on coinage metals (Au, Ag, Cu) [90] alkyl-siloxanes on hydroxyl-terminated surfaces (Si/Si02, glass) [91] carboxylic and 

They are quasi-equilibrium structures that are at, or close to, thermodynamic minima, and that tend, as a consequence, to be self-healing and defect-rejecting [62]. 

SAMs function as ultrathin resists against certain types of etches, and patterned SAMs can also be used as templates to control the nucleation and deposition of other materials (e.g. polymers [96],copper [97] and mammalian cells [98]). 

They can be handled outside of clean room facilities, and certain types of fabrication involving SAMs are relatively low in cost compared with conventional photolithographic methods. 

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Figure C2.4.12. Principle of the microcontact printing process. Chemically patterned organic films witli differently fimctionalized regions can be prepared by a combination of pCP and subsequent immersion.

Xia Y and Whitesides G M 1994 Use of controiied reactive spreading of iiquid aikanethioi on the surface of goid to modify the size of features produced by microcontact printing J. Am. Chem. Soc. 117 3274-5... 

Fischer D, Marti A and Hahner G 1997 Orientation and order in microcontact-printed, seif-assembied monoiayers of aikanethiois on goid investigated with near edge x-ray absorption fine structure spectroscopy J. Vac. Sc/. Technol. A 15 (4) 2173-80... 

J. L. Wilbur, A. Kumar, E. Kim, G. M. Whitesides. Microfabrication by microcontact printing of self-assembled monolayers. Adv Mater (5 600-604, 1994. 

A completely different approach in obtaining S-layer-coated and nncoated areas on solid snpports is the nse of microcontact printing (p.CP) for modifying the snrface properties prior to S-layer protein recrystallization (Fig. 23). Microcontact printing makes use... 

FIG. 23 Schematic drawing of using microcontact printing for obtaining hydrophobic areas on a gold-coated substrate. After pattern transfer (a and b), incubation with an S-layer protein solution (c) leads to the formation of a protein monolayer on the hydrophobic areas only. 

Wolfe, D.B., Love, J.C., Paul, K.E., Chabinyc, M.L. and Whitesides, G.M., Fabrication of palladium-based microelectronic devices by microcontact printing, Applied Physics Letters, 80, 2222, 2002. 

Stamping microcontact printing 50nm-1.5pm Direct development of patterned film Lateral resolution Waveguides, capacitors, diffraction gratings, lab-on-a-chip structures... 

Lakeman, C. D. E. Fleig, P. F. 2002. High resolution integrated passives using microcontact printing. Proc. SPIE Inti. Microelec. Packaging Soc. (IMAPS). pp. 755-759. 

Rogers, J. A. Jackman, R. J. Whitesides, G. M. 1997. Microcontact printing and electroplating on curved substrates Production of free-standing three-dimensional metallic microstructures. Adv. Mater. 9 475 477. 

Deere, M. M. J. Schneider, R. Burdinski, D. Schellekens, J. Saalmink, M. Dona, R. 2004. Wave printing (I) Toward large-arrea, multilayer microcontact printing. Mater. Res. Soc. Symp. Proc. EXS-2 M4.9.1-M4.9.3. 

Shestopalov, A. A. Clark, R. L. Toone, E. J. 2007. Inkless microcontact printing on self-assembled monolayers of Lmoc-protected aminothiols. /. Am. Chem. Soc. 129 13818-13819. 

Q/QH2i p-benzochinone/p-hydrochinone redox couple. NP nanoparticle. RD reductive deposition. jiCP microcontact printing Fc = ferrocenyl. 

Fig. 9.13 a) Preparation of laterally structured SAMs by the microcontact printing (pCP) technique. A structured PDMS stamp is inked with self-assembling molecules (hexa-decanethiols HDT) and placed onto a planar substrate (gold). SAM formation occurs within seconds at the areas of contact (I). The structure can be further processed by etching (II) or deposition of a second SAM (III) onto... 

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