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Metal hardness

These elements form two groups, often called the alkali (Group I) and alkaline earth (Group II) metals. Some of the physical properties usually associated with metals—hardness, high m.p. and b.p.—are noticeably lacking in these metals, but they all have a metallic appearance and are good electrical conductors. Table 6.1 gives some of the physical properties. [Pg.119]

Hardgrove index Hard lenses Hard metals Hardness... [Pg.463]

Generally the harder the ceramic, the better its wear resistance however, other properties such as fracture toughness may play the dominant role. If a ceramic is mated with a metal hardness is the determining factor, but when a ceramic is mated with another ceramic fracture toughness appears to determine the wear rate (54). [Pg.326]

The vessel is generally constructed of carbon steel that has been heat treated. Control of metal hardness is required because of the potential of sulfide-stress cracking. The iron-sponge vessel is either internally coated or clad with stainless steel. [Pg.181]

Hurtling, m. (Metal.) hard slag, also salamander. Harriot, n. hard solder, hartloten, v,t. hard-solder, t aze. [Pg.205]

Lupton, D. and Aldinger, F., Possible Substitutes for Tantalum in Chemical Plant Handling Mineral Acids, in Trends in Refractory Metals, Hard Metals, and Special Materials and Their Technology, Proceedings of the 10th Plansee Seminar, Reutte, Austria 101-130 (1981)... [Pg.905]

A general principle may now be stated which permits correlation of the complexing ability of metals Hard acids tend to associate with hard bases and soft acids with soft bases . This statement must not, however, be regarded as exclusive, i.e. under appropriate conditions soft acids may complex with hard bases or hard acids with soft bases. [Pg.54]

The effect of ligand and metal hardness on the formation of hydrido- and organo-metallic complexes by the -interaction. R. J. Cross, Inorg. Chim. Acta, Rev., 1969, 3,75-79 (52). [Pg.65]

Here we try to gain insight into the trends in reactivity of the metals without getting lost in too much detail. We therefore invoke rather crude approximations. The electronic structure of many metals shows numerous similarities with respect to the sp band, with the metals behaving essentially as free-electron metals. Variations in properties are due to the extent of filling of the d band. We completely neglect the lanthanides and actinides where a localized f orbital is filled, as these metals hardly play a role in catalysis. [Pg.233]

Cotton Metals Hard rubber -14 Polyethylene Polytetrafluorethylene... [Pg.65]

In an attempt to relate the grain size in a metal to its mechanical properties quantitatively, Fetch and Hall (9 and references therein) proposed an expression relating grain size d with hardness H in a metal. Hardness is defined in this case as the yield stress, the stress at which value the material experiences the onset of permanent deformation. Thus,... [Pg.282]

In general, the formation constants of metals with a specific ligand follow the predicted trend and increase in step with increasing metal hardness. Mg, Al, and Mn complexes, however, do not follow this trend. The stability constants of Mg and Al are well established and thus, their anomalous behaviour may indicate the limitation of this simple correlation when comparing A metals (Mg, Al) with d-transition elements (Fe). The data for Mn need to be thoroughly reviewed before any conclusions can be drawn. [Pg.565]

Fig. 2. Histogram of the formation constants of selected I 1 complexes. Formation constants generally increase with increasing metal hardness (increasing charge, decreasing ionic radius) and with increasing ligand hardness. Metal hardness increases from K+ to Zr4+ and ligand hardness from Cl " to OH". The most stable complexes are formed between hard metals and hard ligands, the weakest complexes are formed betweeen soft metals and soft ligands. Fig. 2. Histogram of the formation constants of selected I 1 complexes. Formation constants generally increase with increasing metal hardness (increasing charge, decreasing ionic radius) and with increasing ligand hardness. Metal hardness increases from K+ to Zr4+ and ligand hardness from Cl " to OH". The most stable complexes are formed between hard metals and hard ligands, the weakest complexes are formed betweeen soft metals and soft ligands.
Antimony is used in many alloys, chiefly for its props of hardening the softer metals, such as Pb. The best known of these alloys are type metal, bearing metal, hard lead and pewter. The powdered Sb is used in some pyrotechnic compns, as a fuel (Ref 9, p 32) and as a source of white light (Refs 3a 8)... [Pg.468]

Eddy-Current Methods This is one of the earliest NDT methods and is still used Basically, this method reveals any differences tn electrical impedance between parts to be tested and a reference sample. Parts to be examined are passed through a coil or explored with a probe, and a trace appears on a CRT, Since magnetic and electrical characteristics are closely related to metallurgical quantities, a trace position or pattern or a meter reading clearly shows variations in metal hardness and composition, as well as defects. Both ferrous and nonferrous parts can be tested, and various coils, probes, and detector lips are available,... [Pg.1094]

The selectivity of peptide motifs for certain metals comes from the coordinating contribution from amino acid side chains, the common coordination number of the metal, hardness/softness of the metal ion, ligand field stabilisation effects and the hardness/softness of any coordinating side chains of the amino acid sequence. An example of the influence of side chains and the importance of the position of the side chain comes from the tripeptides Gly-Gly-His, also known as copper binding peptide. The side chain imidazole ring of the His residue has a very efficient nitrogen donor (the imidazole N), which can form a tetradentate chelate ring for coordination as in Scheme 10.3. [Pg.191]

Despite efforts to comply with the limitations on feed water quality, CEDI systems can still foul and scale with microbes, organics, iron and manganese, and calcium- and silica-based scales. This usually occurs due to upsets in the pretreatment system or a deficiency in the system design that result in excursion in feed water quality to the CEDI system. Organics, metals, hardness, and silica problems are usually found on the membranes and sometimes on the resin (as is the case with organics). Biofouling is typically found on the... [Pg.353]

Problems with steam can occur in let-down valves as a result of erosion-corrosion. To prevent attack, hard facing (e.g., stellite) is commonly used when the pressure drop exceeds 150 to 200 psi (1,035 to 1,380 kPa). This limit can be raised to 500 psi (3,450 kPa) for clean, dry steam. Corrosion-erosion also occurs in wet steam. Carbon steel is unsatisfactory in wet steam when pvx, the product of the pressure (psia), velocity (ft/s), and wetness (% water) exceeds 1 x 105. Resistance to wet steam is enhanced by increasing both the metal hardness and chromium content. [Pg.19]

Massive electrochemical attack known as galvanic corrosion [58,59] is the most severe form of copper corrosion. It can completely remove the copper from the structures (Figs. 17.25 and 17.26). It can occur when the wafers are exposed to a corrosive electrolyte for an extended period. It can also occur if the slurry does not contain enough or effective corrosion inhibitor. The source of such a galvanic potential on the patterned copper surface may be due to the fact that some copper structures connected to transistors have a different electrical potential than the rest of the wafer surface. Another possible cause of this type of galvanic potential is related to the barrier material induced metal metal battery effect. Most copper CMP slurries have been developed for Cu structures with Ta or TaN as a barrier material. In some cases, other metals may also be used in addition to the barrier metal. For example, a metal hard mask could contribute to the galvanic corrosion effects. It is also possible that some types of copper are more susceptible to corrosion that others. The grain... [Pg.534]

Pityulin, A. N., Sytschev, A. E., Rogachev, A. S., and Merzhanov, A. G., One-stage production of functionally gradient materials of the metal-hard alloy type by SHS-compaction. Proceedings of the 3rd International Symposium on Structural and Functional Gradient Materials (Book of Abstracts), Lausanne, Switzerland, 25 (1994). [Pg.222]

Metal silicides Manufacture and applications in the metallic hard materials sector, see Section 5,6.9. [Pg.280]


See other pages where Metal hardness is mentioned: [Pg.366]    [Pg.223]    [Pg.427]    [Pg.188]    [Pg.167]    [Pg.85]    [Pg.140]    [Pg.565]    [Pg.72]    [Pg.87]    [Pg.325]    [Pg.335]    [Pg.223]    [Pg.224]    [Pg.184]    [Pg.87]    [Pg.444]    [Pg.533]    [Pg.533]    [Pg.444]    [Pg.484]    [Pg.484]   
See also in sourсe #XX -- [ Pg.7 ]




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