Lead-free ceramic chip

Lead-Free Flip Chips on Ceramic and Organic Carriers... 

The solder balls for area array components (e.g., ceramic ball grid arrays—CBGAs plastic ball grid arrays—PBGAs chip scale packages—CSPs) do have, of course, a processing-related cost that will not have as much effect in blurring the cost differential between lead and lead-free solders as occurs with solder pastes. Like solder bars, the cost of solder will likely track more closely with the raw material cost. 

Visteon participates in external lead-free programs and has internal activities to develop lead-free solder materials. Visteon s first lead-free application is for a mass airflow sensor used in vehicle engine compartments. Production started in the fall of2001 with Sn-Ag-Cu alloy bumps fabricated by stencil printing by business partner Hitachi. The first application is a single chip with eight bumps mounted on a ceramic carrier. 

FIG. 28 Photomicrograph depicting micro structural fracture created due to the Kirkendall eifect within the lead-free solder and Ag-33Pd metallization layer on a ceramic chip capacitor. Note (1) the thick intermetallic compound layer, (2) the Kirkendall voiding between the metal and ceramic capacitor, and (3) the stress-induced cracking in the intermetallic layer. 

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