Layer-processing methods, compatibility

Compatibility with Other Layer-Processing Methods.273... 

In Section 13.2, we introduce the materials used in OLEDs. The most obvious classification of the organic materials used in OLEDs is small molecule versus polymer. This distinction relates more to the processing methods used than to the basic principles of operation of the final device. Small molecule materials are typically coated by thermal evaporation in vacuum, whereas polymers are usually spin-coated from solution. Vacuum evaporation lends itself to easy coaling of successive layers. With solution processing, one must consider the compatibility of each layer with the solvents used for coating subsequent layers. Increasingly, multilayered polymer devices arc being described in the literature and, naturally, hybrid devices with layers of both polymer and small molecule have been made. 

The results summarized here illustrate the importance of identifying a processing method that produces not only the targeted high density and low thickness for each electrolyte layer, but which is also compatible with the combination of materials used in a bilayer electrolyte to avoid inter-reactions between the layers. 

Processing Compatible with subsequently produced layers. Methods... 

Once the structural support layers have been fabricated by extrusion or EPD for tubular cells or by tape casting or powder pressing for planar cells, the subsequent cell layers must be deposited to complete the cell. A wide variety of fabrication methods have been utilized for this purpose, with the choice of method or methods depending on the cell geometry (tubular or planar, and overall size) materials to be deposited and support layer material, both in terms of compatibility of the process with the layer to be deposited and with the previously deposited layers, and desired microstructure of the layer being deposited. In general, the methods can be classified into two very broad categories wet-ceramic techniques and direct-deposition techniques. 

As illustrated in Fig. 15.11, wafers can be bonded face-to-face, the handle of the SOI wafer can be thinned to stop on the buried oxide layer, rebonded to another handle wafer, thinned again to stop on the bonding layer, and then tested. Lu et al. have used this approach to demonstrate process compatibility on passive structures [85], Gutmann et al. have used this method to demonstrate process compatibility using active electrical structures [49], and... 

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