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Laser Ablation Resists Dry Etching

During the last decade laser processing of polymers has become an important field of applied and fundamental research. One of the most promising [Pg.199]

The etch rates at a given fluence are obtained from the slope of linear plots of the etch depth vs the number of pulses delivered at a given fluence. For all polymers linear relations were obtained. A comparison of the etch rates/pulse at low fluences for the different polymers is shown in Fig. 79. [Pg.201]

UV-Vis spectra were recorded before and after immersion. The TC films decomposed totally, while the CM polymer films revealed nearly no changes in the spectra. This shows that the CM polymers are stable under wet acid conditions, and therefore pass the stability criterion. [Pg.202]


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Ablate

Ablation

Ablation resistance

Ablator

Ablators

Dry etch

Dry etch resistance

Dry resistance

Dry resists

Etch resist

Etch resistance

Etching resist

Etching resistance

Laser ablation

Laser etching

Resists etching resistance

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