Joining technology isotropic conductive adhesive

The primary joining techniques used in MID technology are soldering for chips with solder bumps and, for chips with stud bumps, gluing with isotropic conductive adhesive (ICA), anisotropic conductive adhesive (ACA), or nonconductive adhesive (NCA) [81]. 

A key factor in achieving a low-cost flip-chip technology is the use of isotropic conductive adhesives. In comparison to classical flip-chip technologies, the use of ICAs for bumping and joining provides numerous advantages (Table 3). 

Nysaether, J.B. Lai, Z. Liu, J. Isotropically conductive adhesives and solder bumps for flip chip on board circuits—a comparison of lifetime under thermal cychng. Proceedings of the 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, September 1998 125-131. 

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