Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Stud bump

The combination of cured adhesive interconnection, bumps, and organic substrate provides a reliable, cost-effective flip chip CSP. It was determined that Au-stud bumps were preferable to Ni/Au bumps because of the former s compliant nature. Since the planarity control of organic chip carriers is difficult, given the nature of the material, it was simpler to change the interconnection method, ie, using Au-stud bumps. However, electroless Ni/Au bumps are still an option, if the material properties of the ACF and/or chip carrier are altered to provide compliancy. [Pg.1778]

Additional requirements presented by the need for lead-free, RoHS-compUant, green packages call for lead-free solder bumps. Devices that use gold stud bumps previously referenced are... [Pg.92]

FIGURE 6413 Cross section of NCR packaging, (a) Stud bump made by wire bonding machine, (b) Flat bump made by platting process. [Pg.1551]

A conductive epoxy adhesive is screen printed over the connecting pads of the wiring board on top of which the integrated circuit carrying gold stud bumps is flip... [Pg.428]

Figure 40 Flip chip process using gold stud bumps and epoxy conductive adhesive (1) silicon substrate (2) silicon dioxide (3) metal bonding pad (4) silicon nitride passivation (5) stud gold bump (6) silver-filled epoxy adhesive (7) metal bonding pad (8) printed... Figure 40 Flip chip process using gold stud bumps and epoxy conductive adhesive (1) silicon substrate (2) silicon dioxide (3) metal bonding pad (4) silicon nitride passivation (5) stud gold bump (6) silver-filled epoxy adhesive (7) metal bonding pad (8) printed...
The primary joining techniques used in MID technology are soldering for chips with solder bumps and, for chips with stud bumps, gluing with isotropic conductive adhesive (ICA), anisotropic conductive adhesive (ACA), or nonconductive adhesive (NCA) [81]. [Pg.166]

FIGURE 5.21 Stud bump (left) and solder bumps applied by stenciling printing (right)... [Pg.167]

Dressier, M. Reliability Study of Stud Bump Bonding Flip Chip Assemblies on Molded Interconnect Devices. Dissertation, Technische Universitat BerUn, 2010. [Pg.309]

FIG. 16 A schematic of the process flow of j oints formed with stud-bumped flip chips using ICAs. (a) Tips of the gold stud bumps formed with a wire bond tool are planarized, (b) Planarized bumps are dipped into a thin layer of ICA. (c) The chip is withdrawn, leaving the bumps coated with ICA. (d) The chip is placed on mating pads of a chip carrier with pressure required during curing, (e) An underfill (an insulating adhesive) is dispensed and cured. [Pg.750]

A low-cost flip-chip process using stud bumps with an NCA paste that does not require underfilling of the die was developed [123]. It was found to be particularly suitable for organic... [Pg.760]

See other pages where Stud bump is mentioned: [Pg.1788]    [Pg.1788]    [Pg.1788]    [Pg.1789]    [Pg.92]    [Pg.93]    [Pg.95]    [Pg.1551]    [Pg.162]    [Pg.163]    [Pg.167]    [Pg.167]    [Pg.169]    [Pg.749]    [Pg.750]    [Pg.761]    [Pg.761]    [Pg.768]   
See also in sourсe #XX -- [ Pg.167 ]



SEARCH



Studs

© 2024 chempedia.info