Ion beam enhanced deposition IBED

Materials. Biaxially oriented polypropylene (PP) films of 50 um thickness were obtained from 3M and have been described (2). PMDA-ODA (PI) was Kapton H polyimide from Dupont. Copper-plated PTFE films were obtained from Spire Corporation (Bedford, MA). They were prepared using the Ion Beam Enhanced Deposition (IBED) process in which a 100 nm thick Cu film was vapor-deposited onto a PTFE substrate in the presence of a beam of 400 eV Ar+ ions of 25 uA/cm2 (IQ). Shortly before SIMS analysis, the Cu film was removed slowly by peeling at 90° in ambient conditions. Metal-coated PI films were prepared by sputtering 50 nm Cr and 1 um Cu onto a 50 um thick Kapton film on both sides. Thermal annealing was performed in a vacuum chamber at 2xl0 6 torr using a quartz lamp as the heating source. The samples were held for 15 min at the desired temperature and then cooled down to ambient temperature inside the chamber for about 2 hours. Just prior to SIMS analysis, the metal films were peeled slowly at 90° and then immediately introduced into the vacuum chamber of the instrument. 

Two principal classes of diamond film deposition have been developed (I) PACVD (plasma-assisted chemical vapor deposition) and (2) IBED (ion-beam-enhanced deposition). 

There are many physical deposition (PD) processes which can be used to deposit lubricating films on surfaces, and several of them have been used, either separately or in combination, for depositing molybdenum disulphide. They include Ion Beam Enhanced (or Assisted) Deposition (IBED or IBAD), and Pulsed Laser Deposition (PLD), but the most important so far is sputtering, or more precisely sputter-coating. 

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